Invention Grant
- Patent Title: Energy beam treatment to improve packaging reliability
- Patent Title (中): 能量束处理提高包装可靠性
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Application No.: US11196985Application Date: 2005-08-04
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Publication No.: US07678713B2Publication Date: 2010-03-16
- Inventor: Ting Y. Tsui , Andrew McKerrow , Satyavolu Srinivas Papa Rao , Robert Kraft
- Applicant: Ting Y. Tsui , Andrew McKerrow , Satyavolu Srinivas Papa Rao , Robert Kraft
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
The present invention provides a process for improving the hardness and/or modulus of elasticity of a dielectric layer and a method for manufacturing an integrated circuit. The process for improving the hardness and/or modulus of elasticity of a dielectric layer, among other steps, includes providing a dielectric layer having a hardness and a modulus of elasticity, and subjecting the dielectric layer to an energy beam, thereby causing the hardness or modulus of elasticity to increase in value.
Public/Granted literature
- US20070032094A1 Energy beam treatment to improve packaging reliability Public/Granted day:2007-02-08
Information query
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