发明授权
- 专利标题： Substrate based unmolded package
- 专利标题（中）： 基于底物的未模塑包装
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申请号： US12118222申请日： 2008-05-09
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公开(公告)号： US07682877B2公开(公告)日： 2010-03-23
- 发明人: Rajeev Joshi , Jonathan A. Noquil , Consuelo N. Tangpuz
- 申请人： Rajeev Joshi , Jonathan A. Noquil , Consuelo N. Tangpuz
- 申请人地址： US ME South Portland
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US ME South Portland
- 代理机构： Townsend and Townsend and Crew LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a leadframe structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead. The die attach surface and the lead surface can be in different planes.
公开/授权文献
- US20080213946A1 SUBSTRATE BASED UNMOLDED PACKAGE 公开/授权日：2008-09-04
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