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公开(公告)号：US07439613B2
公开(公告)日：2008-10-21
申请号：US10841656
申请日：2004-05-06
IPC分类号： H01L21/44
CPC分类号： H01L23/49861 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/45147
摘要： A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a leadframe structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead. The die attach surface and the lead surface can be in different planes.
摘要翻译： 公开了一种半导体管芯封装。 在一个实施例中，半导体管芯封装具有衬底。 它包括（i）引线框架结构，其包括具有管芯附接表面的管芯附着区域和具有引线表面的引线，以及（ii）模制材料。 裸片附着表面和引线表面通过模制材料暴露。 半导体管芯在管芯附着区域上，并且半导体管芯电耦合到引线。 管芯附着表面和引线表面可以在不同的平面上。
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公开(公告)号：US20080213946A1
公开(公告)日：2008-09-04
申请号：US12118222
申请日：2008-05-09
IPC分类号： H01L21/60
CPC分类号： H01L23/49861 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/45147
摘要： A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a leadframe structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead. The die attach surface and the lead surface can be in different planes.
摘要翻译： 公开了一种半导体管芯封装。 在一个实施例中，半导体管芯封装具有衬底。 它包括（i）引线框架结构，其包括具有管芯附接表面的管芯附着区域和具有引线表面的引线，以及（ii）模制材料。 裸片附着表面和引线表面通过模制材料暴露。 半导体管芯位于管芯附着区域上，半导体管芯与引线电耦合。 管芯附着表面和引线表面可以在不同的平面上。
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公开(公告)号：US07682877B2
公开(公告)日：2010-03-23
申请号：US12118222
申请日：2008-05-09
IPC分类号： H01L21/00
CPC分类号： H01L23/49861 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/45147
摘要： A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a leadframe structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead. The die attach surface and the lead surface can be in different planes.
摘要翻译： 公开了一种半导体管芯封装。 在一个实施例中，半导体管芯封装具有衬底。 它包括（i）引线框架结构，其包括具有管芯附接表面的管芯附着区域和具有引线表面的引线，以及（ii）模制材料。 裸片附着表面和引线表面通过模制材料暴露。 半导体管芯在管芯附着区域上，并且半导体管芯电耦合到引线。 管芯附着表面和引线表面可以在不同的平面上。
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公开(公告)号：US07842555B2
公开(公告)日：2010-11-30
申请号：US12349140
申请日：2009-01-06
CPC分类号： H01L23/562 , H01L23/49562 , H01L23/49575 , H01L24/97 , H01L25/072 , H01L2224/16245 , H01L2224/32245 , H01L2224/73253 , H01L2224/94 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H02M3/00 , H01L2224/83 , H01L2224/81 , H01L2924/00
摘要： An integrated transistor module includes a lead frame that defines at least one low-side land and at least one high-side land. A stepped portion of the lead frame mechanically and electrically interconnects the low-side and high-side lands. A low-side transistor is mounted upon the low-side land with its drain electrically connected to the low-side land. A high-side transistor is mounted upon the high-side land with its source electrically connected to the high-side land.
摘要翻译： 集成晶体管模块包括限定至少一个低侧焊盘和至少一个高侧焊盘的引线框架。 引线框架的台阶部分将低边和高边平台机械地和电气地互连。 低侧晶体管安装在低侧焊盘上，其漏极电连接到低侧焊盘。 高侧晶体管安装在高侧焊盘上，其源极与高侧焊盘电连接。
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公开(公告)号：US07501702B2
公开(公告)日：2009-03-10
申请号：US10876248
申请日：2004-06-24
IPC分类号： H01L29/495
CPC分类号： H01L23/562 , H01L23/49562 , H01L23/49575 , H01L24/97 , H01L25/072 , H01L2224/16245 , H01L2224/32245 , H01L2224/73253 , H01L2224/94 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H02M3/00 , H01L2224/83 , H01L2224/81 , H01L2924/00
摘要： An integrated transistor module includes a lead frame that defines at least one low-side land and at least one high-side land. A stepped portion of the lead frame mechanically and electrically interconnects the low-side and high-side lands. A low-side transistor is mounted upon the low-side land with its drain electrically connected to the low-side land. A high-side transistor is mounted upon the high-side land with its source electrically connected to the high-side land.
摘要翻译： 集成晶体管模块包括限定至少一个低侧焊盘和至少一个高侧焊盘的引线框架。 引线框架的台阶部分将低边和高边平台机械地和电气地互连。 低侧晶体管安装在低侧焊盘上，其漏极电连接到低侧焊盘。 高侧晶体管安装在高侧焊盘上，其源极与高侧焊盘电连接。
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公开(公告)号：US20090117690A1
公开(公告)日：2009-05-07
申请号：US12349140
申请日：2009-01-06
CPC分类号： H01L23/562 , H01L23/49562 , H01L23/49575 , H01L24/97 , H01L25/072 , H01L2224/16245 , H01L2224/32245 , H01L2224/73253 , H01L2224/94 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H02M3/00 , H01L2224/83 , H01L2224/81 , H01L2924/00
摘要： An integrated transistor module includes a lead frame that defines at least one low-side land and at least one high-side land. A stepped portion of the lead frame mechanically and electrically interconnects the low-side and high-side lands. A low-side transistor is mounted upon the low-side land with its drain electrically connected to the low-side land. A high-side transistor is mounted upon the high-side land with its source electrically connected to the high-side land.
摘要翻译： 集成晶体管模块包括限定至少一个低侧焊盘和至少一个高侧焊盘的引线框架。 引线框架的台阶部分将低边和高边平台机械地和电气地互连。 低侧晶体管安装在低侧焊盘上，其漏极电连接到低侧焊盘。 高侧晶体管安装在高侧焊盘上，其源极与高侧焊盘电连接。
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公开(公告)号：US07582956B2
公开(公告)日：2009-09-01
申请号：US11693141
申请日：2007-03-29
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L23/3121 , H01L23/3185 , H01L23/49531 , H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2924/0002 , H01L2924/13091 , H01L2924/00
摘要： A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.
摘要翻译： 一种芯片器件，包括引线框架，模具和模具化合物。 模具的背面被金属化并且通过在模具化合物中限定的窗口暴露，当模具化合物耦合到引线框架时封装模具。 引线框架上的引线耦合到管芯上的源极和栅极端子，而管芯的金属化背面用作漏极端子。
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公开(公告)号：US07154168B2
公开(公告)日：2006-12-26
申请号：US10702792
申请日：2003-11-05
IPC分类号： H01L23/495 , H01L23/498
CPC分类号： H01L23/49562 , H01L23/3121 , H01L23/3185 , H01L23/49531 , H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2924/0002 , H01L2924/13091 , H01L2924/00
摘要： A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.
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公开(公告)号：US07215011B2
公开(公告)日：2007-05-08
申请号：US11213182
申请日：2005-08-25
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L23/3121 , H01L23/3185 , H01L23/49531 , H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2924/0002 , H01L2924/13091 , H01L2924/00
摘要： A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.
摘要翻译： 一种芯片器件，包括引线框架，模具和模具化合物。 模具的背面被金属化并且通过在模具化合物中限定的窗口暴露，当模具化合物耦合到引线框架时封装模具。 引线框架上的引线耦合到管芯上的源极和栅极端子，而管芯的金属化背面用作漏极端子。
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公开(公告)号：US06949410B2
公开(公告)日：2005-09-27
申请号：US10607633
申请日：2003-06-27
IPC分类号： H01L23/48 , H01L21/76 , H01L23/31 , H01L23/495 , H01L23/52 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/49562 , H01L23/3121 , H01L23/3185 , H01L23/49531 , H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2924/0002 , H01L2924/13091 , H01L2924/00
摘要： A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.
摘要翻译： 一种芯片器件，包括引线框架，模具和模具化合物。 模具的背面被金属化并且通过在模具化合物中限定的窗口暴露，当模具化合物耦合到引线框架时封装模具。 引线框架上的引线耦合到管芯上的源极和栅极端子，而管芯的金属化背面用作漏极端子。
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