发明授权
- 专利标题: Positive resist composition and resist pattern forming method
- 专利标题(中): 正抗蚀剂组合物和抗蚀剂图案形成方法
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申请号: US11813765申请日: 2005-12-14
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公开(公告)号: US07687221B2公开(公告)日: 2010-03-30
- 发明人: Taako Hirosaki , Tomoyuki Ando , Takuma Hojo
- 申请人: Taako Hirosaki , Tomoyuki Ando , Takuma Hojo
- 申请人地址: JP Kawasaki-shi
- 专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址: JP Kawasaki-shi
- 代理机构: Knobbe, Martens, Olson & Bear, LLP
- 优先权: JP2005-034103 20050210
- 国际申请: PCT/JP2005/022971 WO 20051214
- 国际公布: WO2006/085419 WO 20060817
- 主分类号: G03F7/039
- IPC分类号: G03F7/039 ; G03F7/20 ; G03F7/30
摘要:
Disclosed is a positive resist composition which can provide a positive resist composition and a resist pattern forming method, capable of forming a high resolution pattern with reduce LER, the positive resist composition comprising a resin component (A) which has acid dissociable, dissolution inhibiting groups and exhibits increased alkali solubility under the action of an acid, and an acid generator component (B) which generates an acid under exposure, wherein the resin component (A) contains a polymer compound (A1) having a structural unit (a1) derived from hydroxystyrene and a structural unit (a2) derived from an acrylate ester having acid dissociable, dissolution inhibiting groups, a fluorine atom or a fluorinated lower alkyl group being bonded at the α-position.
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