发明授权
US07687838B2 Resistive memory device having array of probes and method of manufacturing the resistive memory device
失效
具有探针阵列的电阻式存储器件和制造该阻性存储器件的方法
- 专利标题: Resistive memory device having array of probes and method of manufacturing the resistive memory device
- 专利标题(中): 具有探针阵列的电阻式存储器件和制造该阻性存储器件的方法
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申请号: US11240570申请日: 2005-10-03
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公开(公告)号: US07687838B2公开(公告)日: 2010-03-30
- 发明人: Seung-bum Hong , Ju-hwan Jung , Hyoung-soo Ko , Hong-sik Park , Dong-ki Min , Eun-sik Kim , Chul-min Park , Sung-dong Kim , Kyoung-lock Baeck
- 申请人: Seung-bum Hong , Ju-hwan Jung , Hyoung-soo Ko , Hong-sik Park , Dong-ki Min , Eun-sik Kim , Chul-min Park , Sung-dong Kim , Kyoung-lock Baeck
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Sughrue Mion, PLLC
- 优先权: KR10-2004-0088163 20041102
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; H01L21/00 ; G11B9/00 ; G11B3/00 ; G11B11/00
摘要:
Provided are a resistive memory device having a probe array and a method of manufacturing the same. The resistive memory device includes a memory part having a bottom electrode and a ferroelectric layer sequentially formed on a first substrate; a probe part having an array of resistive probes arranged on a second substrate, with the tips of the resistive probes facing the ferroelectric layer so as to write and read data on the ferroelectric layer; and a binding layer which grabs and fixes the resistive probes on or above the ferroelectric layer. The method of manufacturing the resistive memory device includes forming a bottom electrode and a ferroelectric layer sequentially on a first substrate; forming an array of resistive probes on a second substrate; and wafer level bonding the first substrate to the second substrate using a binding layer such that tips of the resistive probes face the ferroelectric layer.
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