发明授权
- 专利标题： Film formation apparatus and methods including temperature and emissivity/pattern compensation
- 专利标题（中）： 成膜装置及方法，包括温度和发射率/图案补偿
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申请号： US11242298申请日： 2005-09-30
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公开(公告)号： US07691204B2公开(公告)日： 2010-04-06
- 发明人: Juan Chacin , Aaron Hunter , Craig Metzner , Roger N. Anderson
- 申请人： Juan Chacin , Aaron Hunter , Craig Metzner , Roger N. Anderson
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Diehl Servilla LLC
- 代理商 Scott S. Servilla, Esq.
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; C23C16/46 ; C23C16/52 ; H01L21/306
摘要：
A film formation system 10 has a processing chamber 15 bounded by sidewalls 18 and a top cover 11. In one embodiment, the top cover 11 has a reflective surface 13 for reflecting radiant energy back onto a substrate 19, pyrometers 405 for measuring the temperature of the substrate 19 across a number of zones, and at least one emissometer 410 for measuring the actual emissivity of the substrate 19. In another embodiment, a radiant heating system 313 is disposed under the substrate support 16. The temperature of the substrate 19 is obtained from pyrometric data from the pyrometers 405, and the emissometer 410.
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