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US07692279B2 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 有权
半导体多功能封装模块，包括堆叠在球栅阵列封装上的裸片和倒置栅格阵列封装

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
摘要：
A multipackage module has multiple die of various types and having various functions and, in some embodiments, the module includes a digital processor, an analog device, and memory. A first die, having a comparatively large footprint, is mounted onto first die attach region on a surface of a first package substrate. A second die, having a significantly smaller footprint, is mounted upon the surface of the first die, on a second die attach region toward one edge of the first die. The first die is electrically connected by wire bonds to conductive traces in the die-attach side of the substrate. The second die is electrically connected by wire bonds to the first package substrate, and may additionally be electrically connected by wire bonds to the first die.
摘要（中）：

多包装模块具有各种类型的多个管芯并且具有各种功能，并且在一些实施例中，该模块包括数字处理器，模拟设备和存储器。 具有相对较大占地面积的第一模具安装在第一封装衬底的表面上的第一裸片附着区域上。 具有明显更小的占地面积的第二模具安装在第一模具的表面上，朝向第一模具的一个边缘的第二芯片附接区域上。 第一裸片通过引线键合连接到衬底的芯片附接侧中的导电迹线。 第二管芯通过引线接合电连接到第一封装衬底，并且还可以通过引线电连接到第一管芯。

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