发明授权
- 专利标题: Implantation method for doping semiconductor substrate
- 专利标题(中): 掺杂半导体衬底的植入方法
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申请号: US11614586申请日: 2006-12-21
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公开(公告)号: US07696053B2公开(公告)日: 2010-04-13
- 发明人: Tae Woo Kim
- 申请人: Tae Woo Kim
- 申请人地址: KR Seoul
- 专利权人: Dongbu HiTek Co., Ltd.
- 当前专利权人: Dongbu HiTek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: Sherr & Vaughn, PLLC
- 优先权: KR10-2005-0130908 20051227
- 主分类号: H01L21/426
- IPC分类号: H01L21/426
摘要:
Embodiments relate to a semiconductor device that may include a gate stack formed on an upper portion of an active region in a semiconductor substrate, the gate stack including a gate insulating layer and a gate, a first shallow impurity region formed on both sides of the gate in the semiconductor substrate, a gate spacer layer formed on one side of the gate stack, and a second deep impurity region formed in the semiconductor substrate by using the gate spacer layer as a mask, in which the gate is formed by implanting p-type ions.
公开/授权文献
- US20070145432A1 SEMICONDUCTOR DEVICE 公开/授权日:2007-06-28
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