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US07696053B2 Implantation method for doping semiconductor substrate 失效
掺杂半导体衬底的植入方法

  • 专利标题: Implantation method for doping semiconductor substrate
  • 专利标题(中): 掺杂半导体衬底的植入方法
  • 申请号: US11614586
    申请日: 2006-12-21
  • 公开(公告)号: US07696053B2
    公开(公告)日: 2010-04-13
  • 发明人: Tae Woo Kim
  • 申请人: Tae Woo Kim
  • 申请人地址: KR Seoul
  • 专利权人: Dongbu HiTek Co., Ltd.
  • 当前专利权人: Dongbu HiTek Co., Ltd.
  • 当前专利权人地址: KR Seoul
  • 代理机构: Sherr & Vaughn, PLLC
  • 优先权: KR10-2005-0130908 20051227
  • 主分类号: H01L21/426
  • IPC分类号: H01L21/426
Implantation method for doping semiconductor substrate
摘要:
Embodiments relate to a semiconductor device that may include a gate stack formed on an upper portion of an active region in a semiconductor substrate, the gate stack including a gate insulating layer and a gate, a first shallow impurity region formed on both sides of the gate in the semiconductor substrate, a gate spacer layer formed on one side of the gate stack, and a second deep impurity region formed in the semiconductor substrate by using the gate spacer layer as a mask, in which the gate is formed by implanting p-type ions.
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