发明授权
- 专利标题: Doping of semiconductor fin devices
- 专利标题(中): 掺杂半导体鳍片器件
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申请号: US11446890申请日: 2006-06-05
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公开(公告)号: US07701008B2公开(公告)日: 2010-04-20
- 发明人: Yee-Chia Yeo , Ping-Wei Wang , Hao-Yu Chen , Fu-Liang Yang , Chenming Hu
- 申请人: Yee-Chia Yeo , Ping-Wei Wang , Hao-Yu Chen , Fu-Liang Yang , Chenming Hu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface.
公开/授权文献
- US20060220133A1 Doping of semiconductor fin devices 公开/授权日:2006-10-05
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