发明授权
- 专利标题： Measuring and identifying analog characteristics of a microelectronic component at a wafer level and a platform level
- 专利标题（中）： 在晶圆级和平台级测量和识别微电子元件的模拟特性
-
申请号： US11393468申请日： 2006-03-29
-
公开(公告)号： US07705620B2公开(公告)日： 2010-04-27
- 发明人: Mukul Kelkar , Jonathan Kenton , Andy Volk , Iris Wong
- 申请人： Mukul Kelkar , Jonathan Kenton , Andy Volk , Iris Wong
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
A die includes circuit components to perform normal operations and duplicated components of selective ones of the circuit components. Each end of the duplicated components is connected to a pad on the die to allow access by measurement devices. The measurement devices apply electricity to the pads to measure analog characteristics of the duplicated components.
公开/授权文献
信息查询
