Invention Grant
- Patent Title: Bus interconnect switching mechanism
- Patent Title (中): 总线互连切换机制
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Application No.: US12057796Application Date: 2008-03-28
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Publication No.: US07707350B2Publication Date: 2010-04-27
- Inventor: Michael E. Altenburg , Binta M. Patel , Lance Hacking , David K. Dean
- Applicant: Michael E. Altenburg , Binta M. Patel , Lance Hacking , David K. Dean
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Carrie Boone; Carrie A. Boone, P.C.
- Main IPC: G06F13/36
- IPC: G06F13/36
Abstract:
A front side bus swizzle mechanism modifies the front side (address and data) bus on a chip so that, when the chip is positioned on one side of a printed circuit board, connection to a second chip located on the opposite side of the printed circuit board is simplified. The simplified connection may result in less complexity and minimize the consumption of additional printed circuit board real estate.
Public/Granted literature
- US20090248936A1 CHIP INTERCONNECT SWIZZLE MECHANISM Public/Granted day:2009-10-01
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