发明授权
- 专利标题: Variable thickness plate for forming variable wall thickness physical vapor deposition target
- 专利标题(中): 用于形成可变壁厚物理气相沉积靶的可变厚度板
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申请号: US11443232申请日: 2006-05-30
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公开(公告)号: US07708868B2公开(公告)日: 2010-05-04
- 发明人: David B. Smathers , Melvin K. Holcomb , Eric Land
- 申请人: David B. Smathers , Melvin K. Holcomb , Eric Land
- 申请人地址: US OH Grove City
- 专利权人: Tosoh SMD, Inc.
- 当前专利权人: Tosoh SMD, Inc.
- 当前专利权人地址: US OH Grove City
- 代理机构: Wegman, Hessler & Vanderburg
- 主分类号: B23K20/00
- IPC分类号: B23K20/00 ; B21D22/16 ; C23C14/32
摘要:
A variable thickness sputtering target which increases the target material thickness at strategic locations to greatly improve the yield of usable wafers per target, and a method of manufacturing such target comprising forming a generally flat and circularly shaped target blank so that a thickness dimension between the top and bottom surfaces decreases as a function of radius of the target blank. The variable thickness target blank is then formed into a variable thickness dome shaped target member having a bottom portion and a sidewall portion, wherein a wall thickness of said variable thickness dome-shaped target member is thickest proximate a center portion of said bottom portion. In one embodiment of the invention, the variable thickness target blank is formed by clock rolling (or compression rolling) the target blank with crowned rolls to obtain a variable thickness target blank.