发明授权
- 专利标题： Semiconductor device and method of manufacture thereof
- 专利标题（中）： 半导体装置及其制造方法
-
申请号： US11551042申请日： 2006-10-19
-
公开(公告)号： US07714413B2公开(公告)日： 2010-05-11
- 发明人: Noboru Morimoto , Masahiko Fujisawa , Daisuke Kodama
- 申请人： Noboru Morimoto , Masahiko Fujisawa , Daisuke Kodama
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2005-309745 20051025
- 主分类号： H01L23/544
- IPC分类号： H01L23/544
摘要：
A seal ring is provided between a region where a circuit is formed on a semiconductor substrate and a dicing region. The seal ring has a portion where sealing layers of which the cross sectional form is in T-shape are layered and a portion where sealing layers of which the cross sectional form is rectangular are layered.
公开/授权文献
- US20070090447A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF 公开/授权日：2007-04-26
信息查询
IPC分类:
