发明授权
- 专利标题： Resist composition and pattern forming method using the same
- 专利标题（中）： 抗蚀剂组合物和图案形成方法使用其
-
申请号： US11864049申请日： 2007-09-28
-
公开(公告)号： US07718344B2公开(公告)日： 2010-05-18
- 发明人: Sou Kamimura , Kenji Wada , Yasutomo Kawanishi
- 申请人： Sou Kamimura , Kenji Wada , Yasutomo Kawanishi
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Corporation
- 当前专利权人： FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2006-268605 20060929
- 主分类号： G03F7/039
- IPC分类号： G03F7/039 ; G03F7/20 ; G03F7/30
摘要：
A resist composition, includes: (B) a polymer having a group capable of decomposing under an action of an acid and having a weight average molecular weight of 1,000 to 5,000, of which solubility in an alkali developer increases under an action of an acid; and (Z) a compound containing a sulfonium cation having a structure represented by formula (Z-1): wherein Y1 to Y13 each independently represents a hydrogen atom or a substituent, and adjacent members of Y1 to Y13 may combine with each other to form a ring; and Z represents a single bond or a divalent linking group.
公开/授权文献
信息查询
IPC分类:
