发明授权
US07718451B2 Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
有权
用于制造具有图案化金属化封装体的光电子器件的方法和用于含塑料体的图案化金属化的方法
- 专利标题： Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
- 专利标题（中）： 用于制造具有图案化金属化封装体的光电子器件的方法和用于含塑料体的图案化金属化的方法
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申请号： US11880717申请日： 2007-07-23
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公开(公告)号： US07718451B2公开(公告)日： 2010-05-18
- 发明人: Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
- 申请人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
- 申请人地址： DE Regensburg
- 专利权人： Osram Opto Semiconductor GmbH
- 当前专利权人： Osram Opto Semiconductor GmbH
- 当前专利权人地址： DE Regensburg
- 代理机构： Cohen Pontani Lieberman & Pavane LLP
- 优先权： DE10308917 20030228; DE20314966 20030926
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
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