公开(公告)号：US20100000104A1

公开(公告)日：2010-01-07

申请号：US12295794

申请日：2007-04-10

Applicant: Frank Möllmer ,  Frank Singer ,  Michael Schumann ,  Martin Haushalter ,  Thomas Hoefer ,  Christine Rüth ,  Stefan Strüwing

Inventor： Frank Möllmer ,  Frank Singer ,  Michael Schumann ,  Martin Haushalter ,  Thomas Hoefer ,  Christine Rüth ,  Stefan Strüwing

IPC: G01C9/10

CPC classification number: G01C9/10 ,  G01C2009/066 ,  G01C2009/107

Abstract: The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

Abstract translation: 本发明涉及一种倾斜传感器，其包括沿预定路径可移动的至少一个主体和用于确定所述主体的位置的光电单元，所述倾斜传感器可表面安装。 本发明还涉及一种倾斜传感器组件。

公开(公告)号：US07247940B2

公开(公告)日：2007-07-24

申请号：US10792538

申请日：2004-03-01

Applicant: Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

Inventor： Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

IPC: H01L23/03

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

Abstract translation: 一种光电子器件，包括封装主体（57）和布置在封装主体（57）上的至少一个半导体芯片（50）。 封装主体（57）的表面具有金属化子区域（15）和非金属化子区域（20）。 包装体（57）包括至少两种不同的塑料（53,54），塑料中的一种是不可金属化的（54），该塑料确定非金属化子区域（20）。 还提供了用于制造这种组分的方法和用于含塑料体的图案化金属化的方法。

公开(公告)号：US20130200411A1

公开(公告)日：2013-08-08

申请号：US13703075

申请日：2011-05-24

Applicant: David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

Inventor： David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

IPC: H01L33/48

CPC classification number: H01L33/483 ,  H01L33/44 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011

Abstract: An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.

Abstract translation: 光电部件包括具有芯片连接区域的顶侧的电路板，固定到芯片连接区域的光电子半导体芯片，固定到电路板顶侧的电路板并具有反射器区域的壳体主体， 其中所述反射器区域包括在所述壳体中的开口，所述光电子半导体芯片布置在所述开口中，并且所述壳体主体形成有至少在所述反射器区域中的选定位置被金属化的塑料材料。

公开(公告)号：US07975394B2

公开(公告)日：2011-07-12

申请号：US12295794

申请日：2007-04-10

Applicant: Frank Möllmer ,  Frank Singer ,  Michael Schumann ,  Martin Haushalter ,  Thomas Hoefer ,  Christine Rüth ,  Stefan Strüwing

Inventor： Frank Möllmer ,  Frank Singer ,  Michael Schumann ,  Martin Haushalter ,  Thomas Hoefer ,  Christine Rüth ,  Stefan Strüwing

IPC: G01C9/06

CPC classification number: G01C9/10 ,  G01C2009/066 ,  G01C2009/107

Abstract: The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

Abstract translation: 本发明涉及一种倾斜传感器，其包括沿预定路径可移动的至少一个主体和用于确定所述主体的位置的光电单元，所述倾斜传感器可表面安装。 本发明还涉及一种倾斜传感器组件。

公开(公告)号：US20140191253A1

公开(公告)日：2014-07-10

申请号：US14118367

申请日：2011-05-19

Applicant: Stephan Haslbeck ,  Markus Foerste ,  Michael Schwind ,  Martin Haushalter ,  Hubert Halbritter ,  Frank Möllmer

Inventor： Stephan Haslbeck ,  Markus Foerste ,  Michael Schwind ,  Martin Haushalter ,  Hubert Halbritter ,  Frank Möllmer

IPC: H01L25/16 ,  H01L31/0203 ,  H01L33/48

CPC classification number: H01L25/167 ,  H01L25/0753 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/167 ,  H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.

Abstract translation: 光电子器件包括接收或产生辐射的光电子部件，具有空腔的框架，所述光电子部件布置在所述空腔中，固定有光电子部件的连接载体以及覆盖空腔并形成辐射通道 用于辐射的区域，其中从光电子部件到辐射通道区域的光束路径没有用于光电子部件的封装材料。

公开(公告)号：US07700905B2

公开(公告)日：2010-04-20

申请号：US10573095

申请日：2004-08-24

Applicant: Heinz Haas ,  Frank Möllmer ,  Michael Schwind

Inventor： Heinz Haas ,  Frank Möllmer ,  Michael Schwind

IPC: G01J3/50

CPC classification number: H01L31/02162 ,  H01L31/0304 ,  H01L33/44 ,  H01L2224/4847 ,  Y02E10/544

Abstract: The invention concerns a radiation detector for detecting radiation having a defined spectral sensitivity distribution (14) that exhibits a sensitivity maximum at a defined wavelength λ0, wherein the radiation detector preferably contains a III-V semiconductor material and particularly preferably comprises at least one semiconductor chip (1) and at least one optical filter disposed after the semiconductor chip, the semiconductor chip containing at least one III-V semiconductor material and the optical filter absorbing radiation of a wavelength that is greater than the wavelength λ0 of the sensitivity maximum.

Abstract translation: 本发明涉及一种用于检测辐射的辐射检测器，其具有在所确定的波长λ0处呈现灵敏度最大值的限定的光谱灵敏度分布（14），其中辐射检测器优选地包含III-V半导体材料，并且特别优选地包括至少一个半导体芯片 （1）和设置在所述半导体芯片之后的至少一个滤光器，所述半导体芯片包含至少一个III-V半导体材料，并且所述滤光器吸收大于所述灵敏度最大值的波长λ0的波长的辐射。

公开(公告)号：US06552329B2

公开(公告)日：2003-04-22

申请号：US09935502

申请日：2001-08-23

Applicant: Heinz Haas ,  Martin Haushalter ,  Frank Möllmer

Inventor： Heinz Haas ,  Martin Haushalter ,  Frank Möllmer

IPC: G01D534

CPC classification number: G01D5/34715 ,  G01D5/36

Abstract: A method for a quantitative detection of a linear movement or rotary movement. The method includes the steps of emitting radiation from at least two light emitters in a pulsed mode at a same clock frequency or different clock frequencies and detecting the radiation from the two light emitters by a detection device. It furthermore includes the steps of increasingly shadowing the radiations by a movable grid device or separating signals originating from different light emitters by an evaluation circuit coupled to said detection device.

公开(公告)号：US09281301B2

公开(公告)日：2016-03-08

申请号：US14118367

申请日：2011-05-19

Applicant: Stephan Haslbeck ,  Markus Foerste ,  Michael Schwind ,  Martin Haushalter ,  Hubert Halbritter ,  Frank Möllmer

Inventor： Stephan Haslbeck ,  Markus Foerste ,  Michael Schwind ,  Martin Haushalter ,  Hubert Halbritter ,  Frank Möllmer

IPC: H01L33/48 ,  H01L25/16 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/167 ,  H01L33/58 ,  H01L33/60 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L25/0753 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/167 ,  H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.

Abstract translation: 光电子器件包括接收或产生辐射的光电子部件，具有空腔的框架，所述光电子部件布置在所述空腔中，固定有光电子部件的连接载体以及覆盖空腔并形成辐射通道 用于辐射的区域，其中从光电子部件到辐射通道区域的光束路径没有用于光电子部件的封装材料。

公开(公告)号：US08759862B2

公开(公告)日：2014-06-24

申请号：US13703075

申请日：2011-05-24

Applicant: David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

Inventor： David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

IPC: H01L33/00

CPC classification number: H01L33/483 ,  H01L33/44 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011

Abstract: An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.

Abstract translation: 光电部件包括具有芯片连接区域的顶侧的电路板，固定到芯片连接区域的光电子半导体芯片，固定到电路板顶侧的电路板并具有反射器区域的壳体主体， 其中所述反射器区域包括在所述壳体中的开口，所述光电子半导体芯片布置在所述开口中，并且所述壳体主体形成有至少在所述反射器区域中的选定位置被金属化的塑料材料。

公开(公告)号：US07897977B2

公开(公告)日：2011-03-01

申请号：US11577526

申请日：2005-10-25

Applicant: Mike Börner ,  Frank Möllmer

Inventor： Mike Börner ,  Frank Möllmer

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An optoelectronic component includes a component housing and a body comprising a carrier substrate and a radiation emitting layer sequence. In certain embodiments, the body is arranged in a reflector cup of the component housing and is electrically conductively connected to external electrical leads of the component housing. The component housing can also be further provided with a lens that produces a desired aperture angle for the radiation cone. Uses for the component are also described.

Abstract translation: 光电子部件包括部件壳体和包括载体基板和辐射发射层序列的主体。 在某些实施例中，主体被布置在部件壳体的反射杯中，并且电连接到部件壳体的外部电引线。 部件壳体还可以设置有为辐射锥体产生期望的孔径角度的透镜。 还描述了组件的用途。