发明授权
- 专利标题： Semiconductor chip scale package incorporating through-vias electrically connected to a substrate and other vias that are isolated from the substrate, and method of forming the package
- 专利标题（中）： 将与基板电连接的通孔和与基板隔离的其它通孔的半导体芯片级封装以及形成封装的方法
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申请号： US11838917申请日： 2007-08-15
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公开(公告)号： US07719118B2公开(公告)日： 2010-05-18
- 发明人: James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Edmund J. Sprogis
- 申请人： James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Edmund J. Sprogis
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Richard M. Kotulak, Esq.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A semiconductor chip scale package formed with through-vias, which can be either isolated or electrically connected to a substrate, and a method of producing the semiconductor chip scale package with through-vias, which can be isolated or electrically connected to the substrate.
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