发明授权
- 专利标题： Solder foil, semiconductor device and electronic device
- 专利标题（中）： 焊锡箔，半导体器件和电子器件
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申请号： US10451610申请日： 2001-12-19
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公开(公告)号： US07722962B2公开(公告)日： 2010-05-25
- 发明人: Tasao Soga , Hanae Hata , Toshiharu Ishida , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
- 申请人： Tasao Soga , Hanae Hata , Toshiharu Ishida , Kanko Ishida, legal representative , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Townsend and Townsend and Crew LLP
- 优先权： JP2000-393267 20001221
- 国际申请： PCT/JP01/11152 WO 20011219
- 国际公布： WO02/49797 WO 20020627
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/00 ; B32B15/20
摘要：
A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.
公开/授权文献
- US20060061974A1 Solder foil semiconductor device and electronic device 公开/授权日：2006-03-23