发明授权
- 专利标题： Composition providing through plane thermal conductivity
- 专利标题（中）： 组合物通过平面导热性提供
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申请号： US12211805申请日： 2008-09-16
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公开(公告)号： US07723419B1公开(公告)日： 2010-05-25
- 发明人: Hirishikesh Manian , Asis Banerjie , Nishant Negandhi
- 申请人： Hirishikesh Manian , Asis Banerjie , Nishant Negandhi
- 申请人地址： US OH Medina
- 专利权人： Ovation Polymer Technology & Engineered Materials, Inc.
- 当前专利权人： Ovation Polymer Technology & Engineered Materials, Inc.
- 当前专利权人地址： US OH Medina
- 代理机构： Edwin A. Sisson, Attorney at Law, LLC
- 主分类号： C08K3/00
- IPC分类号： C08K3/00 ; C08K3/28 ; A01H5/00 ; B60C1/00 ; C08K3/04 ; C04B26/06 ; C08K3/10
摘要：
This specification discloses a conductive composition relying upon spherical boron nitride particles and thermally expanded graphite to impart high through-plane thermal conductivity in thermoplastics for use in hot environments, including the electronics industry.
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