发明授权
- 专利标题: Semiconductor device having recessed connector portions
- 专利标题(中): 具有凹入连接器部分的半导体器件
-
申请号: US11826673申请日: 2007-07-17
-
公开(公告)号: US07728429B2公开(公告)日: 2010-06-01
- 发明人: Isamu Aokura , Toshiyuki Fukuda , Yukitoshi Ota , Keiji Miki
- 申请人: Isamu Aokura , Toshiyuki Fukuda , Yukitoshi Ota , Keiji Miki
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Steptoe & Johnson LLP
- 优先权: JP2006-205463 20060728
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
A semiconductor device in accordance with the present invention includes IC chips (semiconductor elements) (2, 3, 4) having solder bumps (24) (projecting electrodes) formed on electrode pads, and a first wiring board (1) having connection terminals (7) to which the respective solder bumps (24) of the IC chips (2, 3, 4) are connected, external connection terminals (8) for connection to an external apparatus, and conductor wires (9) provided in respective groove portions formed in a board surface and connected to the respective connection terminals (7). In spite of the reduced pitch of the conductor wires (9), the presence of the groove portions enables an increase in cross section, allowing a reduction in wiring resistance.