Heat sink
    1.
    发明授权
    Heat sink 有权
    散热器

    公开(公告)号:US08813832B2

    公开(公告)日:2014-08-26

    申请号:US13257387

    申请日:2010-03-12

    申请人: Keiji Miki Kenji Ando

    发明人: Keiji Miki Kenji Ando

    摘要: A heat sink which is mounted in a movable body and which is to be exposed to a traveling air stream generated while the movable body moves includes a base and a heat dissipating portion having a plurality of fins. At least in a front end portion of the heat dissipating portion, the heat dissipating portion includes a rectifying portion provided so as to extend across a predetermined area in a longitudinal direction in front portions of slit-shaped flow paths at an upstanding end (i.e., an end apart from the base).

    摘要翻译: 安装在可移动体中并且暴露于可移动体移动时产生的行进气流的散热器包括基部和具有多个翅片的散热部。 至少在散热部的前端部,散热部包括整流部,该整流部设置成在直立端部的狭缝状流路的前方在长度方向上延伸规定的区域(即, 距离基地的一端)。

    Al-Cu bonded structure and method for making the same
    5.
    发明授权
    Al-Cu bonded structure and method for making the same 失效
    Al-Cu键合结构及其制造方法

    公开(公告)号:US06921583B2

    公开(公告)日:2005-07-26

    申请号:US10781358

    申请日:2004-02-17

    摘要: With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al—Cu bonded structure can be obtained as a result of using the Al—Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al—Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchanges and heat transfer devices.

    摘要翻译: 通过Al-Cu键合结构,可以在Al-Cu键合夹层处留下Ag层,提供延性变形行为和键合中间层处的拉伸强度,类似于Al基材料。 这导致优异的粘合特性。 此外,由于使用具有优异的可加工性的Al-Cu异种材料接合部分作为用于进行壁厚降低的轧制的基材,可以获得薄的Al-Cu结合结构。 薄的Al-Cu结构具有优异的尺寸精度,可以满足不同的尺寸要求。 该结构将铝的重量轻重于其特定的传热和散热特性以及Cu的抗腐蚀性能,使其能够满足电子设备的紧凑,薄型,轻量化和高性能的需求。 该结构可广泛用于热交换和热传递装置。

    Al-Cu bonded structure and method for making the same
    6.
    发明申请
    Al-Cu bonded structure and method for making the same 失效
    Al-Cu键合结构及其制造方法

    公开(公告)号:US20050029333A1

    公开(公告)日:2005-02-10

    申请号:US10781358

    申请日:2004-02-17

    摘要: With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer, providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al—Cu bonded structure can be obtained as a result of using the Al—Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al—Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchangers and heat transfer devices.

    摘要翻译: 通过Al-Cu键合结构,可以在Al-Cu键合中间层处保留Ag层,提供与Al基材料类似的粘结中间层的延性变形特性和拉伸强度。 这导致优异的粘合特性。 此外,由于使用具有优异的可加工性的Al-Cu异种材料接合部分作为用于进行壁厚降低的轧制的基材,可以获得薄的Al-Cu结合结构。 薄的Al-Cu结构具有优异的尺寸精度,可以满足不同的尺寸要求。 该结构将铝的重量轻重于其特定的传热和散热特性以及Cu的抗腐蚀性能,使其能够满足电子设备的紧凑,薄型,轻量化和高性能的需求。 该结构可广泛用于热交换器和传热装置。

    HEAT SINK
    7.
    发明申请
    HEAT SINK 有权
    散热器

    公开(公告)号:US20120012294A1

    公开(公告)日:2012-01-19

    申请号:US13257387

    申请日:2010-03-12

    申请人: Keiji Miki Kenji Ando

    发明人: Keiji Miki Kenji Ando

    IPC分类号: F28F7/00

    摘要: A heat sink which is mounted in a movable body and which is to be exposed to a traveling air stream generated while the movable body moves includes a base and a heat dissipating portion having a plurality of fins. At least in a front end portion of the heat dissipating portion, the heat dissipating portion includes a rectifying portion provided so as to extend across a predetermined area in a longitudinal direction in front portions of slit-shaped flow paths at an upstanding end (i.e., an end apart from the base).

    摘要翻译: 安装在可移动体中并且暴露于可移动体移动时产生的行进气流的散热器包括基部和具有多个翅片的散热部。 至少在散热部的前端部,散热部包括整流部,该整流部设置成在直立端部的狭缝状流路的前方在长度方向上延伸规定的区域(即, 距离基地的一端)。