发明授权
- 专利标题: External cavity type semiconductor laser
- 专利标题(中): 外腔型半导体激光器
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申请号: US10579903申请日: 2004-11-30
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公开(公告)号: US07729400B2公开(公告)日: 2010-06-01
- 发明人: Tomiji Tanaka , Kazuo Takahashi , Motonobu Takeya
- 申请人: Tomiji Tanaka , Kazuo Takahashi , Motonobu Takeya
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Rader Fishman & Grauer PLLC
- 优先权: JP2003-404693 20031203
- 国际申请: PCT/JP2004/018101 WO 20041130
- 国际公布: WO2005/055380 WO 20050616
- 主分类号: H01S5/18
- IPC分类号: H01S5/18 ; H01S5/16
摘要:
An external cavity type semiconductor laser that has a larger output and a more excellent single mode characteristic than a conventional external cavity type semiconductor laser is provided. The external cavity type semiconductor laser has a laser diode 11, a window glass 16, a grating, and a lens. The external cavity type semiconductor laser has several modifications over the conventional one. A first modification is that the window glass 16 is inclined to a beam emission surface 19 of a laser diode 11 for a predetermined angle. A second modification is that arrangements of the laser diode 11 and so forth are adjusted so that a S wave reaches the grating. A third modification is that when an output power of the laser diode 11 is 45 mW or less, a kink is suppressed. The other modifications are that a reflectance of a beam emission surface of the laser diode 11, a numerical aperture of the lens, an external cavity length, and a reflectance of a first order beam of the grating are optimized to their proper values.
公开/授权文献
- US20070064755A1 External cavity type semiconductor laser 公开/授权日:2007-03-22
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