发明授权
- 专利标题： Programmable via structure for three dimensional integration technology
- 专利标题（中）： 可编程通孔结构，用于三维集成技术
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申请号： US12178921申请日： 2008-07-24
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公开(公告)号： US07732798B2公开(公告)日： 2010-06-08
- 发明人: Bruce G. Elmegreen , Lia Krusin-Elbaum , Chung Hon Lam , Dennis M. Newns , Matthew R. Wordeman , Albert M. Young
- 申请人： Bruce G. Elmegreen , Lia Krusin-Elbaum , Chung Hon Lam , Dennis M. Newns , Matthew R. Wordeman , Albert M. Young
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Cantor Colburn LLP
- 代理商 Vazken Alexanian
- 主分类号： H01L47/00
- IPC分类号： H01L47/00
摘要：
A programmable link structure for use in three dimensional integration (3DI) semiconductor devices includes a via filled at least in part with a phase change material (PCM) and a heating device proximate the PCM. The heating device is configured to switch the conductivity of a transformable portion of the PCM between a lower resistance crystalline state and a higher resistance amorphous state. Thereby, the via defines a programmable link between an input connection located at one end thereof and an output connection located at another end thereof.