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US07732855B2 Semiconductor memory device including recessed control gate electrode 失效
半导体存储器件包括凹入控制栅电极

Semiconductor memory device including recessed control gate electrode
摘要：
A semiconductor memory device may include a semiconductor substrate, at least one control gate electrode, at least one storage node layer, at least one tunneling insulating layer, at least one blocking insulating layer, and/or first and second channel regions. The at least one control gate electrode may be recessed into the semiconductor substrate. The at least one storage node layer may be between a sidewall of the at least one control gate electrode and the semiconductor substrate. The at least one tunneling insulating layer may be between the at least one storage node layer and the at least one control gate electrode. The at least one blocking insulating layer may be between the storage node layer and the control gate electrode. The first and second channel regions may be between the at least one tunneling insulating layer and the semiconductor substrate to surround at least a portion of the sidewall of the control gate electrode and/or may be separated from each other.
摘要（中）：

半导体存储器件可以包括半导体衬底，至少一个控制栅电极，至少一个存储节点层，至少一个隧道绝缘层，至少一个阻挡绝缘层和/或第一和第二沟道区。 至少一个控制栅电极可以凹进到半导体衬底中。 所述至少一个存储节点层可以在所述至少一个控制栅电极的侧壁和所述半导体衬底之间。 所述至少一个隧道绝缘层可以在所述至少一个存储节点层和所述至少一个控制栅电极之间。 所述至少一个阻挡绝缘层可以在所述存储节点层和所述控制栅电极之间。 第一和第二沟道区可以在至少一个隧道绝缘层和半导体衬底之间，以围绕控制栅电极的侧壁的至少一部分和/或可以彼此分离。

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