发明授权
- 专利标题： Semiconductor light-emitting element assembly with a composite substrate
- 专利标题（中）： 具有复合衬底的半导体发光元件组件
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申请号： US11222803申请日： 2005-09-12
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公开(公告)号： US07745832B2公开(公告)日： 2010-06-29
- 发明人: Min-Hsun Hsieh , Chou-Chih Yin , Chien-Yuan Wang , Jen-Shui Wang , Chia-Fen Tsai , Chia-Liang Hsu
- 申请人： Min-Hsun Hsieh , Chou-Chih Yin , Chien-Yuan Wang , Jen-Shui Wang , Chia-Fen Tsai , Chia-Liang Hsu
- 申请人地址： TW Hsinchu
- 专利权人： Epistar Corporation
- 当前专利权人： Epistar Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： Rabin & Berdo, PC
- 优先权： TW93129157A 20040924; TW94103538A 20050204; TW94114630A 20050506; TW94121784A 20050629; TW94128644A 20050822
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L23/34
摘要：
A semiconductor light-emitting element assembly, comprising a composite substrate, a circuit layout carrier, a connecting structure, a recess, and a semiconductor light-emitting element, is disclosed. The connecting structure is used for bonding the composite substrate with the circuit layout carrier. The recess is formed by the circuit layout carrier and extends toward the composite substrate. The semiconductor light-emitting element is deposited in the recess and electrically connected to the circuit layout carrier.
公开/授权文献
- US20060076571A1 Semiconductor light-emitting element assembly 公开/授权日：2006-04-13
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