LENS FOR USE WITH A LIGHT-EMITTING ELEMENT AND LIGHT SOURCE DEVICE INCLUDING THE LENS
    2.
    发明申请
    LENS FOR USE WITH A LIGHT-EMITTING ELEMENT AND LIGHT SOURCE DEVICE INCLUDING THE LENS 审中-公开
    具有发光元件和光源装置的镜头,包括镜头

    公开(公告)号:US20090067175A1

    公开(公告)日:2009-03-12

    申请号:US12271468

    申请日:2008-11-14

    IPC分类号: F21V14/00

    摘要: A lens for use with a light-emitting element includes a lens body that has a bottom surface for receiving light from the light-emitting element, a top surface opposite to the bottom surface along an optical axis, a peripheral surface extending and converging from the bottom surface to the top surface such that a projection of a perimeter of the top surface onto a plane of the bottom surface is surrounded by a perimeter of the bottom surface, and a textured structure formed on the top surface for scattering light that exits the top surface at angles relative to the optical axis.

    摘要翻译: 用于发光元件的透镜包括透镜体,该透镜体具有用于接收来自发光元件的光的底面,沿着光轴与底面相对的顶面,从所述光轴延伸并会聚的外周面 底表面到顶部表面,使得顶表面的周边的突起到底表面的平面被底表面的周边包围,并且形成在顶表面上的纹理结构用于散射离开顶部的光 表面以相对于光轴的角度。

    Illumination package
    3.
    发明授权
    Illumination package 有权
    照明包

    公开(公告)号:US07454119B2

    公开(公告)日:2008-11-18

    申请号:US11598839

    申请日:2006-11-14

    IPC分类号: G02B6/10

    摘要: An illumination package is disclosed in the invention. The illumination package includes an optical element, package base, and a light emitter. The optical element is designed to redirect a majority of light emitted from the light emitter to a direction approximately perpendicular to a longitudinal axis of the optical element. In one embodiment, the optical element includes an flared portion and a base portion. The flared portion is constructed by an upper surface forming a recess, a side surface adjacent to the upper surface and curved, and a lower surface connecting to the base portion. In another embodiment, a concave lens is formed on the upper surface.

    摘要翻译: 在本发明中公开了一种照明包装。 照明组件包括光学元件,封装基座和光发射器。 光学元件被设计成将从发光器发射的大部分光重定向到大致垂直于光学元件的纵向轴线的方向。 在一个实施例中,光学元件包括扩口部分和基部部分。 扩口部分由形成凹部的上表面,与上表面相邻并弯曲的侧表面和连接到基部的下表面构成。 在另一个实施例中,在上表面上形成凹透镜。

    LED light source
    7.
    发明申请
    LED light source 有权
    LED光源

    公开(公告)号:US20060126343A1

    公开(公告)日:2006-06-15

    申请号:US11302732

    申请日:2005-12-13

    IPC分类号: F21V5/00

    CPC分类号: F21K9/61 F21K9/00 F21Y2115/10

    摘要: A tube type light emitting diode light source including a light source generator, a light guide and a diffuser is provided. The light source generator includes LEDs arranging in a line. The light guide has a grooved light incident surface and a grooved light-guiding surface. The grooved light incident surface encompasses the LEDs, and the grooved light-guiding surface is adapted for changing the propagating direction of an incident light. The diffuser covers the light guide.

    摘要翻译: 提供了包括光源发生器,光导和扩散器的管式发光二极管光源。 光源发生器包括排列成一行的LED。 光导具有凹槽的光入射表面和带槽的光导表面。 带槽的光入射表面包围LED,并且带槽的光导表面适于改变入射光的传播方向。 扩散器覆盖光导。

    Package Structure for Solid-State Lighting with Low Thermal Resistance
    9.
    发明申请
    Package Structure for Solid-State Lighting with Low Thermal Resistance 审中-公开
    具有低热阻的固态照明的封装结构

    公开(公告)号:US20100181891A1

    公开(公告)日:2010-07-22

    申请号:US12688964

    申请日:2010-01-18

    IPC分类号: H01J61/52

    摘要: A package structure for solid-state lighting with low thermal resistance is revealed. A solid-state light is set on a circuit board with high thermal conductivity. A connection layer is used for binding the circuit board with high thermal conductivity and the heat sink substrate. A first attachment layer is set between the heat sink substrate and the connection layer; and a second attachment is set between the connection layer and the circuit board with high thermal conductivity. The connection layer is made of metals or metallic composite materials with high heat dissipation and low thermal expansion coefficients. Thereby, the thermal resistance is lower than the structures according to the prior art. In addition, the thermal stress produced between the heat sink substrate and the circuit board with high thermal conductivity can be buffered by the connection layer for increasing lifetime of the package structure according to the present invention.

    摘要翻译: 揭示了具有低热阻的固态照明的封装结构。 固态光被设置在具有高导热性的电路板上。 连接层用于结合具有高导热性的电路板和散热基板。 第一附接层设置在散热基板和连接层之间; 并且在连接层和具有高导热性的电路板之间设置第二附件。 连接层由具有高散热性和低热膨胀系数的金属或金属复合材料制成。 因此,热阻低于现有技术的结构。 此外,散热基板和具有高热导率的电路板之间产生的热应力可以通过连接层进行缓冲,以增加根据本发明的封装结构的使用寿命。

    Backlight module having independent light source
    10.
    发明授权
    Backlight module having independent light source 有权
    具有独立光源的背光模组

    公开(公告)号:US07168841B2

    公开(公告)日:2007-01-30

    申请号:US11158408

    申请日:2005-06-21

    IPC分类号: F21V8/00

    摘要: A backlight module including an independent light source is provided. The backlight module includes a light generation device, a light transmission device, a light mixing device and a planar light generation device. The light generation device may include one or more light emitting components. The light transmission device may be adopted for receiving and transmitting the light emitted by the light generation device. The light mixing device may be adopted for mixing the light emitted by the light transmission device to generate a mixed linear light. The planar light generation device may comprise a light distributing portion for receiving the mixed linear light to generate a planar light.

    摘要翻译: 提供了包括独立光源的背光模块。 背光模块包括发光装置,光传输装置,光混合装置和平面光产生装置。 光产生装置可以包括一个或多个发光部件。 光传输装置可以用于接收和发送由光产生装置发射的光。 光混合装置可以用于混合由光传输装置发射的光以产生混合线性光。 平面光产生装置可以包括用于接收混合线性光以产生平面光的光分配部分。