发明授权
- 专利标题： Addressable hierarchical metal wire test methodology
- 专利标题（中）： 可寻址的分层金属线测试方法
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申请号： US11619307申请日： 2007-01-03
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公开(公告)号： US07749778B2公开(公告)日： 2010-07-06
- 发明人: Kaushik Chanda , Lawrence Clevenger , Timothy J. Dalton , Louis L. C. Hsu , Chih-Chao Yang
- 申请人： Kaushik Chanda , Lawrence Clevenger , Timothy J. Dalton , Louis L. C. Hsu , Chih-Chao Yang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Kenneth R. Corsello, Esq.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
A method of monitoring and testing electro-migration and time dependent dielectric breakdown includes forming an addressable wiring test array, which includes a plurality or horizontally disposed metal wiring and a plurality of segmented, vertically disposed probing wiring, performing a single row continuity/resistance check to determine which row of said metal wiring is open, performing a full serpentine continuity/resistance check, and determining a position of short defects.
公开/授权文献
- US20080160656A1 ADDRESSABLE HIERARCHICAL METAL WIRE TEST METHODOLOGY 公开/授权日：2008-07-03
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