发明授权
- 专利标题: Method and system for thermal process control
- 专利标题(中): 热过程控制方法和系统
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申请号: US11001767申请日: 2004-12-02
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公开(公告)号: US07751908B2公开(公告)日: 2010-07-06
- 发明人: Yung-Chih Chang , Cheng-I Sun , Chun-I Kuo , Fu-Kun Yeh , Hsueh-Chi Shen
- 申请人: Yung-Chih Chang , Cheng-I Sun , Chun-I Kuo , Fu-Kun Yeh , Hsueh-Chi Shen
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Thomas, Kayden, Horstemeyer & Risley
- 主分类号: G06F19/00
- IPC分类号: G06F19/00 ; G05D7/00
摘要:
A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.
公开/授权文献
- US20060122728A1 Method and system for thermal process control 公开/授权日:2006-06-08
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