发明授权
- 专利标题： Substrate processing apparatus and substrate processing method
- 专利标题（中）： 基板加工装置及基板处理方法
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申请号： US11504581申请日： 2006-08-16
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公开(公告)号： US07757626B2公开(公告)日： 2010-07-20
- 发明人: Hiroshi Shinya , Shouichi Terada , Tsuyoshi Mizuno , Yukihiro Wakamoto
- 申请人： Hiroshi Shinya , Shouichi Terada , Tsuyoshi Mizuno , Yukihiro Wakamoto
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2005-246453 20050826
- 主分类号： B05C11/02
- IPC分类号： B05C11/02 ; B05C11/00 ; B24B29/00
摘要：
In the present invention, a holding table incorporating a heater is provided, for example, in a treatment container of a planarization unit. A pressing plate having a lower surface formed flat is disposed above the holding table. The pressing plate is movable in the vertical direction and can lower to the holding table to press a resist film on the substrate from above. The pressing plate intermittently presses the upper surface of the resist film to planarize the upper surface while the heater is heating the substrate on the holding table at a predetermined temperature to dry the resist film. According to the present invention, a coating film applied on the substrate can be sufficiently planarized and dried.