发明授权
- 专利标题： Semiconductor module
- 专利标题（中）： 半导体模块
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申请号： US12105837申请日： 2008-04-18
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公开(公告)号： US07759163B2公开(公告)日： 2010-07-20
- 发明人: Werner Kroeninger , Josef Schwaiger , Ludwig Schneider , Ottmar Geitner , Markus Brunnbauer , Thorsten Meyer , Ralf Otremba , Josef Hoeglauer , Helmut Strack , Xaver Schloegel
- 申请人： Werner Kroeninger , Josef Schwaiger , Ludwig Schneider , Ottmar Geitner , Markus Brunnbauer , Thorsten Meyer , Ralf Otremba , Josef Hoeglauer , Helmut Strack , Xaver Schloegel
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/48
摘要：
A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.
公开/授权文献
- US20090261468A1 SEMICONDUCTOR MODULE 公开/授权日：2009-10-22