- 专利标题： Electrically stable copper filled electrically conductive adhesive
- 专利标题（中）： 电稳定铜填充导电胶
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申请号： US11072193申请日： 2005-03-04
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公开(公告)号： US07763188B2公开(公告)日： 2010-07-27
- 发明人: Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
- 申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Nugent & Smith, LLP
- 代理商 Theresa O'Rourke Nugent
- 主分类号： H01B1/06
- IPC分类号： H01B1/06 ; H01B1/02
摘要：
An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
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