公开(公告)号：US08293141B2

公开(公告)日：2012-10-23

申请号：US12032645

申请日：2008-02-16

申请人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

发明人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

IPC分类号： H01B1/06 ,  H01B1/02

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

摘要翻译： 一种电子设备，包括由导电粘合剂（ECA）形成的电子电路结构，其具有低且稳定的接触电阻，包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂， 至少一种有机酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

公开(公告)号：US20080230262A1

公开(公告)日：2008-09-25

申请号：US12032645

申请日：2008-02-16

申请人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

发明人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

IPC分类号： H05K1/09 ,  B29C65/52

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

摘要翻译： 一种电子设备，包括由导电粘合剂（ECA）形成的电子电路结构，其具有低且稳定的接触电阻，包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂， 至少一种有机酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

公开(公告)号：US07763188B2

公开(公告)日：2010-07-27

申请号：US11072193

申请日：2005-03-04

申请人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

发明人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

IPC分类号： H01B1/06 ,  H01B1/02

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

摘要翻译： 具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变添加剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂 。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

公开(公告)号：US20080223604A1

公开(公告)日：2008-09-18

申请号：US12032644

申请日：2008-02-16

申请人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

发明人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

IPC分类号： H05K1/09 ,  H01B1/12

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： A process for preparing an electrically conductive adhesive (ECA) with low and stable contact resistance by mixing at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

摘要翻译： 一种通过将至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂，至少一种有机物 酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

公开(公告)号：US09826630B2

公开(公告)日：2017-11-21

申请号：US14477729

申请日：2014-09-04

申请人： Michael B. Vincent

发明人： Michael B. Vincent

IPC分类号： H05K3/30 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K3/10 ,  H05K3/00 ,  H01L23/552 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56

CPC分类号： H05K1/0298 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/552 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0073 ,  H05K3/10 ,  H05K3/4644 ,  H05K2201/0715 ,  Y10T29/4913

摘要： Fan-Out Wafer Level Packages (FO-WLPs) and methods for fabricating FO-WLPs having Embedded Ground Plane (EGP) connections are provided. In one embodiment, the method includes forming a molded panel around an EGP array from which a plurality of preformed EGP connections project. One or more Redistribution Layers (RDLs) are produced over the molded panel. The molded panel is then singulated to yield a plurality of FO-WLPs each including a molded package body containing an EGP from the EGP array and one or more of preformed EGP connections.

公开(公告)号：US09524950B2

公开(公告)日：2016-12-20

申请号：US13906621

申请日：2013-05-31

申请人： Weng F. Yap ,  Michael B. Vincent

发明人： Weng F. Yap ,  Michael B. Vincent

IPC分类号： H01L21/44 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00

CPC分类号： H01L24/97 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1815 ,  H01L2924/00

摘要： A method for fabricating a stacked microelectronic device includes attaching a first package layer to a second package layer to form stacked microelectronic layers. Saw streets of the first package layer overlie and are aligned with saw streets of the second package layer. The first and second package layers include respective edge connectors formed between the saw streets and electronic components in the first and second package layers. A through package via is formed in one of the saw streets of the first and second package layers. The via is filled with conductive material. The stacked package layers are singulated along the saw streets in a manner that retains a portion of the conductive material to form a sidewall connector between at least two of the edge connectors.

摘要翻译： 一种用于制造堆叠的微电子器件的方法包括将第一封装层附接到第二封装层以形成堆叠的微电子层。 第一包装层的锯街道覆盖并与第二包装层的锯切街道对齐。 第一和第二封装层包括形成在第一和第二封装层中的锯条和电子部件之间的相应的边缘连接器。 通过包装通孔形成在第一和第二包装层的锯条之一中。 通孔填充有导电材料。 堆叠的封装层沿着锯条街道以保持导电材料的一部分以在至少两个边缘连接器之间形成侧壁连接器的方式被切割。

公开(公告)号：US09245819B2

公开(公告)日：2016-01-26

申请号：US13402413

申请日：2012-02-22

申请人： Michael B. Vincent

发明人： Michael B. Vincent

IPC分类号： H05K3/30 ,  H01L23/433 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L23/373

CPC分类号： H01L23/4334 ,  H01L21/6835 ,  H01L23/315 ,  H01L23/3737 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/27002 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2748 ,  H01L2224/2784 ,  H01L2224/27848 ,  H01L2224/279 ,  H01L2224/28105 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/29017 ,  H01L2224/29022 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/73153 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/35121 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L21/78 ,  H01L21/568 ,  H01L2224/274 ,  H01L2224/273 ,  H01L2924/00

摘要： An electrical component package is disclosed comprising: an electrical component having an embedded surface, a structure attached to the electrical component opposite the embedded surface, a conductive adhesive directly attached to the embedded surface, where the conductive adhesive is shaped to taper away from the embedded surface, and an encapsulation material covering the conductive adhesive and the electrical component. In various embodiments, the tapered conductive adhesive facilitates the securing of the conductive adhesive to the electrical component by the encapsulation material. Also disclosed are various methods of forming an electrical component package having a single interface conductive interconnection on the embedded surface. The conductive interconnection is configured to maintain an interconnection while under stress forces. Further disclosed in a method of applied a conductive adhesive that enables design flexibility regarding the shape and depth of the conductive interconnection.

摘要翻译： 公开了一种电气部件封装，包括：具有嵌入表面的电气部件，与嵌入表面相对的电气部件附接的结构，直接附着到嵌入表面的导电粘合剂，其中导电粘合剂成形为远离嵌入式 表面和覆盖导电粘合剂和电气部件的封装材料。 在各种实施例中，锥形导电粘合剂有助于通过封装材料将导电粘合剂固定到电气部件。 还公开了形成在嵌入表面上具有单个界面导电互连的电气部件封装的各种方法。 导电互连配置为在应力下保持互连。 进一步公开了一种应用导电粘合剂的方法，其使得能够对导电互连的形状和深度设计灵活性。

公开(公告)号：US20140054783A1

公开(公告)日：2014-02-27

申请号：US13591924

申请日：2012-08-22

申请人： ZHIWEI GONG (Tony) ,  Michael B. Vincent ,  Scott M. Hayes ,  Jason R. Wright

发明人： ZHIWEI GONG (Tony) ,  Michael B. Vincent ,  Scott M. Hayes ,  Jason R. Wright

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L25/065 ,  H01L24/19 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Methods for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging a plurality of microelectronic device panels in a panel stack. Each microelectronic device panel contains plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are created in the panel stack exposing the plurality of package edge conductors, and a plurality of sidewall conductors is formed interconnecting different ones of the package edge conductors exposed through the trenches. The panel stack is then separated into a plurality of stacked microelectronic packages each including at least two microelectronic devices electrically interconnected by at least one of the plurality of sidewall conductors included within the stacked microelectronic package.

摘要翻译： 提供了堆叠的微电子封装的制造方法，如堆叠的微电子封装的实施例。 在一个实施例中，该方法包括在面板堆叠中布置多个微电子器件面板。 每个微电子器件面板包含多个微电子器件和从其延伸的多个封装边缘导体。 在面板堆叠中产生暴露多个封装边缘导体的沟槽，并且形成多个侧壁导体，其互连通过沟槽暴露的不同封装边缘导体。 面板堆叠然后被分离成多个层叠的微电子封装，每个包含至少两个微电子器件，所述至少两个微电子器件由堆叠的微电子封装内的多个侧壁导体中的至少一个电气互连。

公开(公告)号：US07408264B2

公开(公告)日：2008-08-05

申请号：US11497685

申请日：2006-08-02

申请人： Clément J. Fortin ,  Pierre M. Langevin ,  Son K. Tran ,  Michael B. Vincent

发明人： Clément J. Fortin ,  Pierre M. Langevin ,  Son K. Tran ,  Michael B. Vincent

IPC分类号： H01L23/31

CPC分类号： H05K3/3442 ,  H01L21/563 ,  H01L2924/0002 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

摘要： An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.

摘要翻译： 提供电子制造工艺和结构，用于在单个步骤中将分立的被动表面贴装器件（SMD）附接到衬底。 含有助焊剂材料的液体流动树脂密封剂被分配在基材上的预铸焊盘之间。 具有一对电触点的SMD被压入所述密封剂中，使得电触头与所述预铸焊盘接触。 施加热量以首先激活所述焊剂材料，然后回流所述预铸焊盘上的焊料，以将所述SMD触点接合到所述预铸焊盘。 回流温度保持约180秒，在此期间树脂固化。 树脂密封剂填充基板和SMD之间的空间，并在焊接接合点周围形成圆角。

公开(公告)号：US06815258B2

公开(公告)日：2004-11-09

申请号：US10635774

申请日：2003-08-06

申请人： Michael B. Vincent

发明人： Michael B. Vincent

IPC分类号： H01L2144

CPC分类号： H01L23/295 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A method and structure for solderably coupling a semiconductor chip to a substrate, with an underfill between the chip and the substrate. In forming the structure, underfill material is dispensed upon a conductive pad on the substrate. The underfill material comprises a resin and a filler. The filler density is less than the resin density. The chip is moved toward the substrate and into the underfill until a solder member coupled to the chip is proximate the conductive pad. The structure is heated, resulting in soldering the solder member to the conductive pad and in curing the underfill. Filler particles move through the resin and toward the chip, resulting in an increased filler concentration near the solder member, and a reduced underfill coefficient of thermal expansion (CTE) near the solder member that is close to the CTE of the solder member.