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1.发明授权公开(公告)号：US08293141B2
公开(公告)日：2012-10-23
申请号：US12032645
申请日：2008-02-16
申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
发明人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
摘要翻译： 一种电子设备，包括由导电粘合剂（ECA）形成的电子电路结构，其具有低且稳定的接触电阻，包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂， 至少一种有机酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。
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公开(公告)号：US20080230262A1
公开(公告)日：2008-09-25
申请号：US12032645
申请日：2008-02-16
申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
发明人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
摘要翻译： 一种电子设备，包括由导电粘合剂（ECA）形成的电子电路结构，其具有低且稳定的接触电阻，包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂， 至少一种有机酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。
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公开(公告)号：US07763188B2
公开(公告)日：2010-07-27
申请号：US11072193
申请日：2005-03-04
申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
发明人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
摘要翻译： 具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变添加剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂 。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。
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4.发明申请PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE 审中-公开制备电性稳定的铜填充电导体粘合剂的方法公开(公告)号：US20080223604A1
公开(公告)日：2008-09-18
申请号：US12032644
申请日：2008-02-16
申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
发明人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： A process for preparing an electrically conductive adhesive (ECA) with low and stable contact resistance by mixing at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
摘要翻译： 一种通过将至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂，至少一种有机物 酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。
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