Invention Grant
US07765691B2 Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate
有权
使用激光辅助金属化和基板图形化的印刷电路板的方法和装置
- Patent Title: Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate
- Patent Title (中): 使用激光辅助金属化和基板图形化的印刷电路板的方法和装置
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Application No.: US11320922Application Date: 2005-12-28
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Publication No.: US07765691B2Publication Date: 2010-08-03
- Inventor: Islam A. Salama
- Applicant: Islam A. Salama
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K3/02
- IPC: H05K3/02
Abstract:
A printed circuit is made by laser projection patterning a metal panel of a substrate, laminating a dielectric layer on the metal panel, laser irradiating the substrate to form vias in the substrate, laser activating a seed coat on the substrate, washing the seed coat from an unpatterned portion of the substrate, forming a patterned build-up layer on the substrate, and etching away a metal plating forming metal protrusions.
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