Invention Grant
- Patent Title: Micro-fluid ejection assemblies
- Patent Title (中): 微流体喷射组件
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Application No.: US10940917Application Date: 2004-09-14
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Publication No.: US07767103B2Publication Date: 2010-08-03
- Inventor: David L. Bernard , John W. Krawczyk , Christopher J. Money , Andrew L. McNees , Girish S. Patil , Karthik Vaideeswaran , Richard L. Warner
- Applicant: David L. Bernard , John W. Krawczyk , Christopher J. Money , Andrew L. McNees , Girish S. Patil , Karthik Vaideeswaran , Richard L. Warner
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Main IPC: G01D15/00
- IPC: G01D15/00 ; B41J2/05
Abstract:
A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.
Public/Granted literature
- US20060054591A1 Micro-fluid ejection assemblies Public/Granted day:2006-03-16
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