发明授权
- 专利标题： Semiconductor component including semiconductor chip and method for producing the same
- 专利标题（中）： 包括半导体芯片的半导体元件及其制造方法
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申请号： US11598203申请日： 2006-11-13
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公开(公告)号： US07768107B2公开(公告)日： 2010-08-03
- 发明人: Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
- 申请人： Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理机构： Edell, Shapiro & Finnan, LLC
- 优先权： DE102005054268 20051111
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor component includes at least one semiconductor chip arranged on a mounting substrate and connected thereto via bonding wires. For effective dissipation of heat, a solderable interlayer is arranged on the active upper side of the semiconductor chip and a heat sink is soldered onto the solderable interlayer. A method is also described for producing a semiconductor component with a solderable interlayer disposed on an active upper side of a semiconductor chip and with a heat sink soldered to the solderable interlayer.
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