An FPGA needs extremely large numbers of switches in its wiring architecture and therefore shows low logic density and low operating speed. This tendency becomes increasingly evident with high integration FPGAs. 3-dimensional FPGAs are getting attention for potential improvements in their operating speed and logic density. However, 3-dimensional integration processes have poor yield and are difficult to adapt for the production of devices with fine features. In addition, difficulty in heat radiation imposes limits on the number of stacks. The present invention exploits advantages of the 3-dimensional FPGA to deliver FPGAs with high speed/high integration and which resolves difficulty in manufacturing processes. The present invention solves problems by proposing a design method for an FPGA in which a high dimensional FPGA switch topology is embedded in a lower dimensional integrated circuit and a semiconductor integrated circuit including an FPGA in which a high dimensional FPGA switch topology is embedded in a lower dimensional integrated circuit.