发明授权
US07771559B2 Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
失效
电极连接方法,表面处理电路板和方法中使用的粘合膜,以及电极连接结构
- 专利标题: Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
- 专利标题(中): 电极连接方法,表面处理电路板和方法中使用的粘合膜,以及电极连接结构
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申请号: US11494709申请日: 2006-07-28
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公开(公告)号: US07771559B2公开(公告)日: 2010-08-10
- 发明人: Isao Tsukagoshi , Yasushi Gotou , Masami Yusa , Yasuo Miyadera
- 申请人: Isao Tsukagoshi , Yasushi Gotou , Masami Yusa , Yasuo Miyadera
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2002-53910 20020228; JP2002-53911 20020228
- 主分类号: C09J5/00
- IPC分类号: C09J5/00
摘要:
The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
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