公开(公告)号：US07771559B2

公开(公告)日：2010-08-10

申请号：US11494709

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C09J5/00

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种电极连接方法，其特征在于，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂芳基的芳族基团，R 1表示烷基，氟化烷基 R 1为0〜4的烷氧基或卤素原子，X表示O或N-R 3，条件是R 3表示以下基团之中，Y表示SO 2或Co，n表示重复单元数 在聚合物中，作为至少部分地彼此相对的电极之间的压敏导电聚合物; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理的布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。

公开(公告)号：US07528488B2

公开(公告)日：2009-05-05

申请号：US11494708

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： H01L23/52

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种电极连接方法，其特征在于，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂芳基的芳族基团，R 1表示烷基，氟化烷基 R 1为0〜4的烷氧基或卤素原子，X表示O或N-R 3，条件是R 3表示以下基团之中，Y表示SO 2或Co，n表示重复单元数 在聚合物中，作为至少部分地彼此相对的电极之间的压敏导电聚合物; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理的布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。

公开(公告)号：US07387914B2

公开(公告)日：2008-06-17

申请号：US11379921

申请日：2006-04-24

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US5997829A

公开(公告)日：1999-12-07

申请号：US973001

申请日：1997-11-26

申请人： Yoshika Sekine ,  Kenji Tonoki ,  Tatsuya Uchida ,  Yasuo Miyadera ,  Hiroyuki Kawada ,  Takayuki Senda

发明人： Yoshika Sekine ,  Kenji Tonoki ,  Tatsuya Uchida ,  Yasuo Miyadera ,  Hiroyuki Kawada ,  Takayuki Senda

IPC分类号： B01D53/04 ,  B01D53/86 ,  B01J20/28 ,  B01J31/06 ,  B01J35/06 ,  B01J23/00 ,  B01J34/07

CPC分类号： B01D53/02 ,  B01D53/86 ,  B01J20/28004 ,  B01J20/28028 ,  B01J20/28033 ,  B01J20/28045 ,  B01J31/06 ,  B01J35/06 ,  B01D2253/102 ,  B01D2253/104 ,  B01D2253/106 ,  B01D2253/108 ,  B01D2253/11 ,  B01D2253/112 ,  B01D2253/202 ,  B01D2253/304 ,  B01D2253/3425 ,  B01D2257/90 ,  B01J2231/70 ,  Y10S502/507

摘要： The present invention is directed to a sheet-form environment purifying material comprising particles of metal and/or metal oxide consisting essentially of at least one member being selected from the group consisting of manganese, copper, zinc, iron, vanadium, nickel, titanium, palladium, platinum, manganese oxide, copper oxide, zinc oxide, iron oxide, vanadium oxide, nickel oxide, titanium oxide, palladium oxide, and platinum oxide, adsorbent particles consisting essentially of at least one member selected from the group consisting of activated carbon, zeolite, silica gel, sepiolite, activated alumina and activated clay, thermoplastic resin particles being selected from ultrahigh-molecular weight polyethylene, polyethylene, polycarbonate, polyamide acrylonitrile-butadiene-styrene resins, polyimide, polyvinyl chloride, cellulose acetate, polysulfone, polystyrene phthalate and polypropylene, and an air-permeable sheet of fibrous. The metal and/or metal oxide particles and the adsorbent particles are respectively bound to the thermoplastic resin particles while retaining their inherent surface areas and performances without being covered by the thermoplastic resin layers, and the thermoplastic resin particles are joined to the fibrous substrate. The present invention is also directed to a process for making the environment purifying material which comprises the steps of mixing all the particles and heating the mixture at a temperature not lower than the melting point of the thermoplastic resin and not higher than the thermal decomposition temperature thereof. The environment purifying material of the present invention is useful as deodorizers and harmful gas removers.

摘要翻译： PCT No.PCT / JP96 / 01423 Sec。 371日期：1997年11月26日 102（e）日期1997年11月26日PCT提交1996年5月27日PCT公布。 第WO96 / 37288号公报 日期：1996年11月28日本发明涉及包含金属和/或金属氧化物颗粒的片状环境净化材料，其基本上由至少一种选自锰，铜，锌，铁，钒 ，镍，钛，钯，铂，氧化锰，氧化铜，氧化锌，氧化铁，氧化钒，氧化镍，氧化钛，氧化钯和氧化铂，吸附剂颗粒基本上由至少一种选自 由活性炭，沸石，硅胶，海泡石，活性氧化铝和活性白土组成的热塑性树脂颗粒，选自超高分子量聚乙烯，聚乙烯，聚碳酸酯，聚酰胺丙烯腈 - 丁二烯 - 苯乙烯树脂，聚酰亚胺，聚氯乙烯，醋酸纤维素， 聚砜，聚苯乙烯邻苯二甲酸酯和聚丙烯，以及纤维状透气性片。 金属和/或金属氧化物颗粒和吸附剂颗粒分别结合到热塑性树脂颗粒上，同时保持其固有的表面积和性能而不被热塑性树脂层覆盖，并且热塑性树脂颗粒与纤维基材接合。 本发明还涉及一种环境净化材料的制造方法，该方法包括以下步骤：将所有颗粒混合并在不低于热塑性树脂的熔点的温度下加热混合物，并且不高于其热分解温度 。 本发明的环境净化材料可用作除臭剂和有害气体去除剂。

公开(公告)号：US5667899A

公开(公告)日：1997-09-16

申请号：US482516

申请日：1995-06-07

申请人： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

发明人： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

IPC分类号： C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  B32B27/18 ,  C09J7/00

CPC分类号： C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  C08J2379/08 ,  Y10S428/901 ,  Y10S525/928 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

摘要翻译： 用于将IC或LSI与引线框架接合的导电接合膜。 该膜包含（A）通过使四羧酸二酐组分反应得到的聚酰亚胺树脂，其中由下式（I）表示的四羧酸二酐的含量：其中n表示2-20的整数 至少70摩尔％，与二胺; 和（B）导电填料。 任选地，该膜还可以包含每分子具有至少两个热交联的酰亚胺基的热固性树脂或酰亚胺化合物。

公开(公告)号：US5115089A

公开(公告)日：1992-05-19

申请号：US245157

申请日：1988-09-16

申请人： Masatoshi Yoshida ,  Katsuji Shibata ,  Mitsumasa Kojima ,  Hidetaka Satou ,  Toshihiko Kato ,  Yasuo Miyadera ,  Masami Yusa

发明人： Masatoshi Yoshida ,  Katsuji Shibata ,  Mitsumasa Kojima ,  Hidetaka Satou ,  Toshihiko Kato ,  Yasuo Miyadera ,  Masami Yusa

IPC分类号： C08G73/06 ,  C08G73/10

CPC分类号： C08G73/06 ,  C08G73/0677 ,  C08G73/1007 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1085

摘要： Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

公开(公告)号：US4833204A

公开(公告)日：1989-05-23

申请号：US240604

申请日：1988-09-06

申请人： Masami Yusa ,  Katsuji Shibata ,  Yasuo Miyadera

发明人： Masami Yusa ,  Katsuji Shibata ,  Yasuo Miyadera

IPC分类号： C08L63/02 ,  C08G59/68 ,  C08L63/00 ,  H05K1/03

CPC分类号： H05K1/0326 ,  C08G59/686 ,  C08L63/00

摘要： An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.

摘要翻译： 一种用于覆铜层压板的环氧树脂组合物，其包含在一个分子中具有至少两个环氧基的环氧树脂，在一个分子中具有至少两个官能团的酚化合物作为硬化剂，具有掩蔽的亚氨基的咪唑化合物作为 硬化促进剂和选自由式R 1 -NH-CO-NH 2表示的脲衍生物的一种或多种氮化合物，其中R 1是氢或有机基团; 酰胺化合物; 和胍衍生物，其有利地用于覆铜层压板的材料。 因此，覆铜层压板特别用于制造印刷电路板，其显着提高了其铜箔的开孔性，耐剥离性，粘合性和耐热性。 此外，该环氧树脂组合物具有优异的储存稳定性。

公开(公告)号：US4064289A

公开(公告)日：1977-12-20

申请号：US606354

申请日：1975-08-21

申请人： Takashi Yokoyama ,  Yasuo Miyadera ,  Nobuhiko Shito ,  Hiroshi Suzuki ,  Yoshiaki Wakashima

发明人： Takashi Yokoyama ,  Yasuo Miyadera ,  Nobuhiko Shito ,  Hiroshi Suzuki ,  Yoshiaki Wakashima

IPC分类号： C08L79/04 ,  H01B3/30 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/30

CPC分类号： H01B3/306 ,  C08L79/04 ,  H01L21/312 ,  H01L23/293 ,  H01L23/3171 ,  H01L2924/0002 ,  Y10T428/31721

摘要： Method of making a semiconductor device which includes applying a solution of a heterocyclic ring-containing polymer in an organic solvent to a desired surface of a semiconductor body and removing the organic solvent from the solution by heat thereby to form a coating of a polymer on the surface, wherein the polymer is a reaction product of a diamine represented by the formula: ##STR1## with a tetracarboxylic acid or anhydride of it. Since the coating exhibits good thermal stability and good electrical properties when applied to the surface of the semiconductor, it is useful as a passivating film.

摘要翻译： 制造半导体器件的方法包括将含有杂环的聚合物在有机溶剂中的溶液施加到半导体本体的所需表面，并通过热从溶液中除去有机溶剂，从而形成聚合物的涂层 表面，其中聚合物是由下式表示的二胺与四羧酸或其酸酐的反应产物。 由于当涂覆在半导体的表面上时，涂层具有良好的热稳定性和良好的电学性能，因此可用作钝化膜。

公开(公告)号：US07258918B2

公开(公告)日：2007-08-21

申请号：US10345166

申请日：2003-01-16

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： B32B7/12

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.

摘要翻译： 一种粘合膜，其包括能够通过加热或光照射固化的反应性粘合剂和由式I表示的多苯酞：其中R表示二价芳族烃基或含二价杂环的芳族基团，R 1， 表示R 1的数为0〜4的烷基，氟化烷基，烷氧基或卤素原子，X表示O或NR 3， 条件是R 3表示以下基团之一，Y表示SO 2或CO，n表示聚合物中的重复单元数。 粘合膜可用于将例如半导体芯片的电极连接到布线板的电极。 多苯酞可用于表面处理例如布线板的电极。

公开(公告)号：US20060180903A1

公开(公告)日：2006-08-17

申请号：US11379921

申请日：2006-04-24

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。