发明授权
US07771579B2 Electro chemical plating additives for improving stress and leveling effect
有权
电化学镀添加剂，用于改善应力和流平作用
- 专利标题： Electro chemical plating additives for improving stress and leveling effect
- 专利标题（中）： 电化学镀添加剂，用于改善应力和流平作用
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申请号： US11004294申请日： 2004-12-03
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公开(公告)号： US07771579B2公开(公告)日： 2010-08-10
- 发明人: Ting-Chu Ko , Chien-Hsueh Shih , Minghsing Tsai
- 申请人： Ting-Chu Ko , Chien-Hsueh Shih , Minghsing Tsai
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Duane Morris LLP
- 主分类号： C25D3/38
- IPC分类号： C25D3/38
摘要：
A chemical solution for an electro chemical plating process includes an electro chemical plating solution; and an additive, added in the electro chemical plating solution, substantially consisting of a polymer with one or more kinds of impurities, wherein each kind of the impurities has a density, with respect to the polymer, lower then 1019 atoms/cc.