发明授权
- 专利标题： High resolution substrate holder leveling device and method
- 专利标题（中）： 高分辨率基板支架调平装置及方法
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申请号： US12252277申请日： 2008-10-15
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公开(公告)号： US07790229B2公开(公告)日： 2010-09-07
- 发明人: Kirby Floyd
- 申请人： Kirby Floyd
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Townsend and Townsend and Crew
- 主分类号： A23G3/24
- IPC分类号： A23G3/24 ; B05C3/00 ; C23C16/00
摘要：
A method for adjusting a spacing of a leveling plate from a chamber body comprises attaching a mounting stud that includes a stud threaded surface to the chamber body. An adjustment screw is provided that has a first threaded surface threadingly engaged with the stud threaded surface. A bushing is provided that has a bushing threaded surface threadingly engaged with a second threaded surface of the adjustment screw. The bushing is movably coupled to the leveling plate. Coarse adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud. The bushing is fixed to the leveling plate. Fine adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud and the bushing.
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