In Situ Substrate Holder Leveling Method and Apparatus
    1.
    发明申请
    In Situ Substrate Holder Leveling Method and Apparatus 失效
    原位基板固定器调平方法和装置

    公开(公告)号:US20080286444A1

    公开(公告)日:2008-11-20

    申请号:US12182345

    申请日:2008-07-30

    IPC分类号: C23C16/52

    摘要: Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is directed to a method of adjusting a spacing between a gas distribution member and a substrate support disposed generally opposite from the gas distribution member, wherein the substrate support is configured to support a substrate on which to form a layer with improved thickness uniformity. The method comprises forming a layer on the substrate disposed on the substrate support; measuring a thickness of the layer on the substrate; and calculating differences in thickness between a reference location on the substrate and a plurality of remaining locations on the substrate. The method further comprises computing spacing adjustment amounts for the remaining locations relative to the reference location based on the differences in thickness between the reference location and the remaining locations. The spacing adjustment amount is positive to increase the spacing between the substrate support at the location and the gas distribution member if the thickness is greater at the location than at the reference location. The spacing adjustment amount is negative to decrease the spacing between the substrate support at the location if the thickness is smaller at the location than at the reference location.

    摘要翻译: 本发明的实施例涉及调整衬底支撑件和气体分配构件的面板之间的间隔,以实现在衬底上形成的层的改进的均匀性。 本发明的一个实施例涉及一种调节气体分配构件和大致与气体分配构件相对设置的衬底支撑件之间的间隔的方法,其中衬底支撑件构造成支撑衬底,以在其上形成具有 改善厚度均匀性。 该方法包括在设置在基板支撑件上的基板上形成一层; 测量衬底上的层的厚度; 并且计算衬底上的参考位置与衬底上的多个剩余位置之间的厚度差异。 该方法还包括基于参考位置和其余位置之间的厚度差来计算相对于参考位置的剩余位置的间隔调整量。 如果位置处的厚度大于在参考位置处的厚度,则间距调节量是正的以增加位置处的衬底支撑件与气体分配构件之间的间隔。 如果在位置处的厚度小于在参考位置处的厚度,则间距调节量是负的,以减小位置处的衬底支撑件之间的间隔。

    HIGH RESOLUTION SUBSTRATE HOLDER LEVELING DEVICE AND METHOD
    2.
    发明申请
    HIGH RESOLUTION SUBSTRATE HOLDER LEVELING DEVICE AND METHOD 有权
    高分辨率基板保持器调平装置及方法

    公开(公告)号:US20090031957A1

    公开(公告)日:2009-02-05

    申请号:US12252277

    申请日:2008-10-15

    申请人: Kirby Floyd

    发明人: Kirby Floyd

    IPC分类号: C23C16/00

    CPC分类号: C23C16/4583 Y10T74/18752

    摘要: A method for adjusting a spacing of a leveling plate from a chamber body comprises attaching a mounting stud that includes a stud threaded surface to the chamber body. An adjustment screw is provided that has a first threaded surface threadingly engaged with the stud threaded surface. A bushing is provided that has a bushing threaded surface threadingly engaged with a second threaded surface of the adjustment screw. The bushing is movably coupled to the leveling plate. Coarse adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud. The bushing is fixed to the leveling plate. Fine adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud and the bushing.

    摘要翻译: 用于调节调平板与室主体的间隔的方法包括将包括螺柱螺纹表面的安装螺柱附接到室主体。 提供了一种调节螺钉,其具有与螺柱螺纹表面螺纹接合的第一螺纹表面。 提供了一种衬套,其具有与调节螺钉的第二螺纹表面螺纹接合的衬套螺纹表面。 衬套可移动地联接到调平板。 通过相对于安装螺栓旋转调节螺钉来进行调平板和室体之间的间距的粗调。 套管固定在校平板上。 通过相对于安装螺柱和衬套旋转调节螺钉来调整调平板和腔体之间的间距。

    In situ substrate holder leveling method and apparatus
    3.
    发明授权
    In situ substrate holder leveling method and apparatus 失效
    原位衬底保持器调平方法和装置

    公开(公告)号:US07413612B2

    公开(公告)日:2008-08-19

    申请号:US10618187

    申请日:2003-07-10

    IPC分类号: C23C16/00 C23F1/00 H01L21/306

    摘要: Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is directed to a method of adjusting a spacing between a gas distribution member and a substrate support disposed generally opposite from the gas distribution member, wherein the substrate support is configured to support a substrate on which to form a layer with improved thickness uniformity. The method comprises forming a layer on the substrate disposed on the substrate support; measuring a thickness of the layer on the substrate; and calculating differences in thickness between a reference location on the substrate and a plurality of remaining locations on the substrate. The method further comprises computing spacing adjustment amounts for the remaining locations relative to the reference location based on the differences in thickness between the reference location and the remaining locations. The spacing adjustment amount is positive to increase the spacing between the substrate support at the location and the gas distribution member if the thickness is greater at the location than at the reference location. The spacing adjustment amount is negative to decrease the spacing between the substrate support at the location if the thickness is smaller at the location than at the reference location.

    摘要翻译: 本发明的实施例涉及调整衬底支撑件和气体分配构件的面板之间的间隔,以实现在衬底上形成的层的改进的均匀性。 本发明的一个实施例涉及一种调节气体分配构件和大致与气体分配构件相对设置的衬底支撑件之间的间隔的方法,其中衬底支撑件构造成支撑衬底,以在其上形成具有 改善厚度均匀性。 该方法包括在设置在基板支撑件上的基板上形成一层; 测量衬底上的层的厚度; 并且计算衬底上的参考位置与衬底上的多个剩余位置之间的厚度差异。 该方法还包括基于参考位置和其余位置之间的厚度差来计算相对于参考位置的剩余位置的间隔调整量。 如果位置处的厚度大于在参考位置处的厚度,则间距调节量是正的以增加位置处的衬底支撑件与气体分配构件之间的间隔。 如果在位置处的厚度小于在参考位置处的厚度,则间距调节量是负的,以减小位置处的衬底支撑件之间的间隔。

    In situ substrate holder leveling method and apparatus
    4.
    发明申请
    In situ substrate holder leveling method and apparatus 失效
    原位衬底保持器调平方法和装置

    公开(公告)号:US20050006556A1

    公开(公告)日:2005-01-13

    申请号:US10618187

    申请日:2003-07-10

    摘要: Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is directed to a method of adjusting a spacing between a gas distribution member and a substrate support disposed generally opposite from the gas distribution member, wherein the substrate support is configured to support a substrate on which to form a layer with improved thickness uniformity. The method comprises forming a layer on the substrate disposed on the substrate support; measuring a thickness of the layer on the substrate; and calculating differences in thickness between a reference location on the substrate and a plurality of remaining locations on the substrate. The method further comprises computing spacing adjustment amounts for the remaining locations relative to the reference location based on the differences in thickness between the reference location and the remaining locations. The spacing adjustment amount is positive to increase the spacing between the substrate support at the location and the gas distribution member if the thickness is greater at the location than at the reference location. The spacing adjustment amount is negative to decrease the spacing between the substrate support at the location if the thickness is smaller at the location than at the reference location.

    摘要翻译: 本发明的实施例涉及调整衬底支撑件和气体分配构件的面板之间的间隔,以实现在衬底上形成的层的改进的均匀性。 本发明的一个实施例涉及一种调节气体分配构件和大致与气体分配构件相对设置的衬底支撑件之间的间隔的方法,其中衬底支撑件构造成支撑衬底,以在其上形成具有 改善厚度均匀性。 该方法包括在设置在基板支撑件上的基板上形成一层; 测量衬底上的层的厚度; 并且计算衬底上的参考位置与衬底上的多个剩余位置之间的厚度差异。 该方法还包括基于参考位置和其余位置之间的厚度差来计算相对于参考位置的剩余位置的间隔调整量。 如果位置处的厚度大于在参考位置处的厚度,则间距调节量是正的以增加位置处的衬底支撑件与气体分配构件之间的间隔。 如果在位置处的厚度小于在参考位置处的厚度,则间距调节量是负的,以减小位置处的衬底支撑件之间的间隔。

    High resolution substrate holder leveling device and method
    5.
    发明授权
    High resolution substrate holder leveling device and method 有权
    高分辨率基板支架调平装置及方法

    公开(公告)号:US07790229B2

    公开(公告)日:2010-09-07

    申请号:US12252277

    申请日:2008-10-15

    申请人: Kirby Floyd

    发明人: Kirby Floyd

    IPC分类号: A23G3/24 B05C3/00 C23C16/00

    CPC分类号: C23C16/4583 Y10T74/18752

    摘要: A method for adjusting a spacing of a leveling plate from a chamber body comprises attaching a mounting stud that includes a stud threaded surface to the chamber body. An adjustment screw is provided that has a first threaded surface threadingly engaged with the stud threaded surface. A bushing is provided that has a bushing threaded surface threadingly engaged with a second threaded surface of the adjustment screw. The bushing is movably coupled to the leveling plate. Coarse adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud. The bushing is fixed to the leveling plate. Fine adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud and the bushing.

    摘要翻译: 用于调节调平板与室主体的间隔的方法包括将包括螺柱螺纹表面的安装螺柱附接到室主体。 提供了一种调节螺钉,其具有与螺柱螺纹表面螺纹接合的第一螺纹表面。 提供了一种衬套,其具有与调节螺钉的第二螺纹表面螺纹接合的衬套螺纹表面。 衬套可移动地联接到调平板。 通过相对于安装螺栓旋转调节螺钉来进行调平板和室体之间的间距的粗调。 套管固定在校平板上。 通过相对于安装螺柱和衬套旋转调节螺钉来调整调平板和腔体之间的间距。

    High resolution substrate holder leveling device and method
    7.
    发明授权
    High resolution substrate holder leveling device and method 有权
    高分辨率基板支架调平装置及方法

    公开(公告)号:US07572340B2

    公开(公告)日:2009-08-11

    申请号:US11118254

    申请日:2005-04-29

    申请人: Kirby Floyd

    发明人: Kirby Floyd

    IPC分类号: A23G3/24 B05C3/00

    CPC分类号: C23C16/4583 Y10T74/18752

    摘要: A device for adjusting a spacing between a chamber body such as a chamber body and a leveling plate such as a leveling plate comprises a mounting stud configured to be mounted to the chamber body. The mounting stud includes a stud threaded surface. A bushing is capable of being fixed to the leveling plate, and includes a bushing threaded surface. An adjustment screw has a first threaded surface threadingly engaged with the stud threaded surface of the mounting stud, and a second threaded surface threadingly engaged with the bushing threaded surface of the bushing. The threaded surfaces are configured, when the bushing is fixed to the leveling plate and the adjustment screw is turned, to cause the adjustment screw to move in a first direction with respect to the mounting stud at a first rate and the bushing to move in a second direction opposite from the first direction with respect to the adjustment screw at a second rate which is different from the first rate.

    摘要翻译: 用于调节室主体(诸如室主体)和诸如调平板的调平板之间的间隔的装置包括构造成安装到室主体的安装螺柱。 安装螺柱包括螺柱螺纹表面。 衬套能够固定到调平板,并且包括衬套螺纹表面。 调节螺钉具有与安装螺柱的螺柱螺纹表面螺纹接合的第一螺纹表面和与衬套的衬套螺纹表面螺纹接合的第二螺纹表面。 螺纹表面被构造成当衬套固定到调平板并且调节螺钉转动时,使得调节螺钉以第一速率相对于安装螺柱沿第一方向移动,并且套管移动到 第二方向相对于调节螺钉以与第一速率不同的第二速率相对于第一方向。

    High resolution substrate holder leveling device and method

    公开(公告)号:US20060112884A1

    公开(公告)日:2006-06-01

    申请号:US11118254

    申请日:2005-04-29

    申请人: Kirby Floyd

    发明人: Kirby Floyd

    IPC分类号: C23C16/00

    CPC分类号: C23C16/4583 Y10T74/18752

    摘要: A device for adjusting a spacing between a chamber body such as a chamber body and a leveling plate such as a leveling plate comprises a mounting stud configured to be mounted to the chamber body. The mounting stud includes a stud threaded surface. A bushing is capable of being fixed to the leveling plate, and includes a bushing threaded surface. An adjustment screw has a first threaded surface threadingly engaged with the stud threaded surface of the mounting stud, and a second threaded surface threadingly engaged with the bushing threaded surface of the bushing. The threaded surfaces are configured, when the bushing is fixed to the leveling plate and the adjustment screw is turned, to cause the adjustment screw to move in a first direction with respect to the mounting stud at a first rate and the bushing to move in a second direction opposite from the first direction with respect to the adjustment screw at a second rate which is different from the first rate.

    Backflush chamber clean
    9.
    发明授权
    Backflush chamber clean 失效
    反吹室清洁

    公开(公告)号:US07037376B2

    公开(公告)日:2006-05-02

    申请号:US10412446

    申请日:2003-04-11

    摘要: A processing chamber may be effectively cleaned by a remote plasma flowed through the chamber in a direction opposite to the direction of gas flowed during wafer processing. Specifically, the remotely generated plasma may be introduced directly into the chamber through a processing gas exhaust or other port, and then be exhausted from the chamber by traveling through the gas distribution shower head to the foreline. In one embodiment of the present invention, this reverse flow of remote cleaning plasma is maintained for the duration of the chamber cleaning step. In an alternative embodiment, the direction of flow of the remote cleaning plasma through the chamber is alternated between this reverse flow and a conventional forward flow.

    摘要翻译: 可以通过与在晶片处理期间流动的气体的方向相反的方向通过腔室的远程等离子体有效地清洁处理室。 具体地说,远程产生的等离子体可以通过处理气体排出口或其他端口直接引入室内,然后通过气体分配淋浴头行进到前级管线从腔室排出。 在本发明的一个实施例中,在室清洁步骤的持续时间内,保持远程清洁等离子体的这种反向流动。 在替代实施例中,远程清洁等离子体通过室的流动方向在该反向流和常规正向流之间交替。