Invention Grant
US07790591B2 Methods of manufacturing semiconductor devices including metal oxide layers
有权
制造包括金属氧化物层的半导体器件的方法
- Patent Title: Methods of manufacturing semiconductor devices including metal oxide layers
- Patent Title (中): 制造包括金属氧化物层的半导体器件的方法
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Application No.: US12270014Application Date: 2008-11-13
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Publication No.: US07790591B2Publication Date: 2010-09-07
- Inventor: Dong-chul Yoo , Myoung-bum Lee , Young-geun Park , Han-mei Choi , Se-hoon Oh , Byong-ju Kim , Kyong-won An , Seon-ho Jo
- Applicant: Dong-chul Yoo , Myoung-bum Lee , Young-geun Park , Han-mei Choi , Se-hoon Oh , Byong-ju Kim , Kyong-won An , Seon-ho Jo
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2007-0115491 20071113; KR10-2007-0116142 20071114; KR10-2008-0099349 20081009
- Main IPC: H01L21/3205
- IPC: H01L21/3205 ; H01L21/4763

Abstract:
Methods of manufacturing a semiconductor device are provided including forming a charge storage layer on a gate insulating layer that is on a semiconductor substrate. A blocking insulating layer is formed on the charge storage layer and an electrode layer is formed on the blocking insulating layer. The blocking insulating layer may be formed by forming a lower metal oxide layer at a first temperature and forming an upper metal oxide layer on the lower metal oxide layer at a second temperature, lower than the first temperature.
Public/Granted literature
- US20090124070A1 Methods of Manufacturing Semiconductor Devices Including Metal Oxide Layers Public/Granted day:2009-05-14
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