Invention Grant
- Patent Title: System, apparatus, and method for advanced solder bumping
- Patent Title (中): 高级焊锡凸块的系统，设备和方法
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Application No.: US12394542Application Date: 2009-02-27
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Publication No.: US07790598B2Publication Date: 2010-09-07
- Inventor: Mengzhi Pang , Christopher J. Bahr , Ravindra Tanikella , Charan Gurumurthy
- Applicant: Mengzhi Pang , Christopher J. Bahr , Ravindra Tanikella , Charan Gurumurthy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.
Public/Granted literature
- US20090196000A1 SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING Public/Granted day:2009-08-06
Information query
IPC分类:
