公开(公告)号：US08222750B2

公开(公告)日：2012-07-17

申请号：US12364435

申请日：2009-02-02

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: H01L21/00

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且开口可以形成在复合材料中或通过复合材料，对应于在纳米丝阵列中提供的空间。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US20090192241A1

公开(公告)日：2009-07-30

申请号：US12364435

申请日：2009-02-02

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: B32B3/24 ,  C08K3/38

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且可以将复合材料的开口形成为对应于在纳米丝阵列中提供的空间的复合材料。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US07517788B2

公开(公告)日：2009-04-14

申请号：US11321103

申请日：2005-12-29

Applicant: Mengzhi Pang ,  Christopher J. Bahr ,  Ravindra Tanikella ,  Charan Gurumurthy

Inventor： Mengzhi Pang ,  Christopher J. Bahr ,  Ravindra Tanikella ,  Charan Gurumurthy

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H01L24/11 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577

Abstract: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.

Abstract translation: 根据一些实施例，提供了一种方法，装置和系统。 在一些实施例中，该方法包括在衬底的表面上提供阻焊材料，在阻焊材料的顶部上涂覆掩模材料，回流焊料位于通过阻焊材料和掩模材料形成的开口中， 焊料回流后的掩模材料。

公开(公告)号：US08530890B2

公开(公告)日：2013-09-10

申请号：US13533920

申请日：2012-06-26

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: H01L21/00

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

公开(公告)号：US20120270008A1

公开(公告)日：2012-10-25

申请号：US13533920

申请日：2012-06-26

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: B32B27/12 ,  B32B27/38 ,  B32B27/34 ,  B32B5/08 ,  B32B5/16 ,  B82Y30/00

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且开口可以形成在复合材料中或通过复合材料，对应于在纳米丝阵列中提供的空间。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US07534648B2

公开(公告)日：2009-05-19

申请号：US11479246

申请日：2006-06-29

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: H01L21/00

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且可以将复合材料的开口形成为对应于在纳米丝阵列中提供的空间的复合材料。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US20070152024A1

公开(公告)日：2007-07-05

申请号：US11321103

申请日：2005-12-29

Applicant: Mengzhi Pang ,  Christopher Bahr ,  Ravindra Tanikella ,  Charan Gurumuthy

Inventor： Mengzhi Pang ,  Christopher Bahr ,  Ravindra Tanikella ,  Charan Gurumuthy

IPC: B23K31/02 ,  H01L21/00

CPC classification number: H01L24/11 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577

Abstract: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.

Abstract translation: 根据一些实施例，提供了一种方法，装置和系统。 在一些实施例中，该方法包括在衬底的表面上提供阻焊材料，在阻焊材料的顶部上涂覆掩模材料，回流焊料位于通过阻焊材料和掩模材料形成的开口中， 焊料回流后的掩模材料。

公开(公告)号：US20070096083A1

公开(公告)日：2007-05-03

申请号：US11259806

申请日：2005-10-27

Applicant: Nachiket Raravikar ,  Ravindra Tanikella ,  Nirupama Chakrapani

Inventor： Nachiket Raravikar ,  Ravindra Tanikella ,  Nirupama Chakrapani

IPC: H01L51/00

CPC classification number: B82Y40/00 ,  B82Y10/00 ,  B82Y30/00 ,  C01B32/168 ,  C01B32/174 ,  C01B2202/22 ,  C08K7/24 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/026

Abstract: Embodiments of substrate core polymer nanocomposite with nanoparticles and randomly oriented nanotubes and method for making the substrate core are generally described herein. Other embodiments may be described and claimed. In some embodiments, a nanotube suspension is combined with nanoparticle-impregnated polymer.

Abstract translation: 具有纳米颗粒和随机取向的纳米管的衬底芯聚合物纳米复合材料的实施方案和制备衬底芯的方法一般在本文中描述。 可以描述和要求保护其他实施例。 在一些实施方案中，将纳米管悬浮液与纳米颗粒浸渍的聚合物组合。

公开(公告)号：US20060060956A1

公开(公告)日：2006-03-23

申请号：US10948386

申请日：2004-09-22

Applicant: Ravindra Tanikella

Inventor： Ravindra Tanikella

IPC: H01L23/02

CPC classification number: H01L23/49894 ,  C08F283/04 ,  C08G73/121 ,  C08K3/36 ,  C08K9/10 ,  C08K2201/011 ,  C08L79/08 ,  C08L2666/66 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/15787 ,  H01L2924/15791 ,  H01L2924/18161 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/28 ,  H05K3/421 ,  H05K3/422 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/1163 ,  H05K2203/121 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

Abstract translation: 用于微电子封装的高度可靠的互连。 在一个实施例中，积层互连中的电介质层具有玻璃化转变温度的等级; 并且稍后施加的电介质层在低于较早施加的电介质层的玻璃化转变温度的温度下被层压。 在一个实施方案中，通过热固化工艺增加了积聚互连中早期施加的介电膜的玻璃化转变温度，以超过用于层压后来施加的电介质膜的温度。 在一个实施方案中，在层压聚酰亚胺材料的膜（例如，通过催化剂的密封剂的光化学或热降解）之后，用嵌入的催化剂形成聚酰亚胺材料以促进交联。 在一个实施例中，阻焊剂开口壁具有通过激光辅助接种产生的可湿性层，使得阻焊剂开口壁之间没有间隙，并且在阻焊剂开口中没有底部填充物。

公开(公告)号：US20080012155A1

公开(公告)日：2008-01-17

申请号：US11479246

申请日：2006-06-29

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: H01L23/29

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且开口可以形成在复合材料中或通过复合材料，对应于在纳米丝阵列中提供的空间。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。