发明授权
- 专利标题： Techniques for providing decoupling capacitance
- 专利标题（中）： 提供去耦电容的技术
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申请号： US11930698申请日： 2007-10-31
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公开(公告)号： US07791168B2公开(公告)日： 2010-09-07
- 发明人: Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
- 申请人： Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Ryan, Mason & Lewis, LLP
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/52 ; H01L23/04 ; H01L23/053
摘要：
Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device includes at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device including at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein includes the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.
公开/授权文献
- US20080067628A1 TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE 公开/授权日：2008-03-20
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