发明授权
- 专利标题: Light emitting diode structure and method for fabricating the same
- 专利标题(中): 发光二极管结构及其制造方法
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申请号: US12538427申请日: 2009-08-10
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公开(公告)号: US07799593B2公开(公告)日: 2010-09-21
- 发明人: Chia-Ming Lee , Hung-Cheng Lin , Jen-Inn Chyi
- 申请人: Chia-Ming Lee , Hung-Cheng Lin , Jen-Inn Chyi
- 申请人地址: TW Nantou
- 专利权人: Tekcore Co., Ltd.
- 当前专利权人: Tekcore Co., Ltd.
- 当前专利权人地址: TW Nantou
- 代理机构: Muncy, Geissler, Olds & Lowe, PLLC
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
The present invention discloses a light emitting diode structure and a method for fabricating the same. In the present invention, a substrate is placed in a solution to form a chemical reaction layer. Next, the substrate is etched to form a plurality of concave zones and a plurality of convex zones with the chemical reaction layer overhead. Next, the chemical reaction layer is removed to form an irregular geometry of the concave zones and convex zones on the surface of the substrate. Then, a semiconductor light emitting structure is epitaxially formed on the surface of the substrate. Thereby, the present invention can achieve a light emitting diode structure having improved internal and external quantum efficiencies.
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