发明授权
- 专利标题: Integrated circuit including a semiconductor device
- 专利标题(中): 包括半导体器件的集成电路
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申请号: US11870750申请日: 2007-10-11
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公开(公告)号: US07800171B2公开(公告)日: 2010-09-21
- 发明人: Mathias Von Borcke , Markus Zundel , Thorsten Meyer , Uwe Schmalzbauer
- 申请人: Mathias Von Borcke , Markus Zundel , Thorsten Meyer , Uwe Schmalzbauer
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: Dicke, Billig & Czaja, PLLC
- 优先权: DE102006048625 20061013
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
An integrated circuit including a semiconductor device is disclosed. One embodiment provides a load current component, having a multiplicity of trenches in a cell array. A sensor component is integrated into the cell array of the load current component and has a sensor cell array, the area of which is smaller than the area of the cell array of the load current component by a specific factor. The trenches forming the cell array of the sensor component correspond to the trenches of the cell array of the load current component, configured such that the trenches of the sensor component at the at least one side merge uniformly into the trenches of the cell array of the load current component without interruptions or disturbances of the trench geometry.
公开/授权文献
- US20080088355A1 INTEGRATED CIRCUIT INCLUDING A SEMICONDUCTOR DEVICE 公开/授权日:2008-04-17
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