Invention Grant
- Patent Title: Heat-expanded microspheres, production process thereof, heat-expandable microspheres and application thereof
- Patent Title (中): 热膨胀微球,其制备方法,热膨胀性微球及其应用
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Application No.: US10595910Application Date: 2004-11-15
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Publication No.: US07807729B2Publication Date: 2010-10-05
- Inventor: Toshiaki Masuda , Takashi Fujie , Ichiro Takahara , Ikuo Yosejima , Katsushi Miki
- Applicant: Toshiaki Masuda , Takashi Fujie , Ichiro Takahara , Ikuo Yosejima , Katsushi Miki
- Applicant Address: JP Yao-Shi
- Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
- Current Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
- Current Assignee Address: JP Yao-Shi
- Agency: Global IP Counselors, LLP
- Priority: JP2003-428337 20031119; JP2003-431301 20031120; JP2004-274187 20040824
- International Application: PCT/JP2004/016940 WO 20041115
- International Announcement: WO2005/049698 WO 20050602
- Main IPC: C08J9/22
- IPC: C08J9/22 ; C08J9/16 ; B32B27/00

Abstract:
A production process for heat-expanded microspheres includes the step of providing a gaseous fluid containing heat-expandable microspheres, which includes a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 μm. The gaseous fluid is fed through a gas-introducing tube having a dispersion nozzle on its outlet that is fixed inside a conduit having a hot gas flow flowing therethrough. A jet of the gaseous fluid is emitted through the dispersion nozzle. Further, the gaseous fluid is collided on a collision plate fixed under the dispersion nozzle so as to disperse the heat-expandable microspheres in the hot gas flow. The dispersed heat-expandable microspheres are heated in the hot gas flow at a temperature not lower than their expansion initiating temperature and thus expanded.
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