发明授权
- 专利标题： Electronic device including a conductive stud over a bonding pad region
- 专利标题（中）： 电子设备包括在焊盘区域上的导电柱
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申请号： US11501096申请日： 2006-08-07
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公开(公告)号： US07812448B2公开(公告)日： 2010-10-12
- 发明人: Lakshmi N. Ramanathan , Tien Yu T. Lee , Jinbang Tang
- 申请人： Lakshmi N. Ramanathan , Tien Yu T. Lee , Jinbang Tang
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electronic device can include an interconnect level (16) including a bonding pad region (110). An insulating layer (18) can overlie the interconnect level (16) and include an opening (112, 24) over the bonding pad region (110). In one embodiment, a conductive stud (34) can lie within the opening (112, 24) and can be substantially encapsulated. In another embodiment, the electronic device can include a barrier layer (22) lying along a side and a bottom of the opening (112, 24) and a conductive stud (34) lying within the opening (112, 24). The conductive stud (34) can substantially fill the opening (112, 24). A majority of the conductive stud (34) can lie within the opening (112, 24). In still another embodiment, a process for forming an electronic device can include forming a conductive stud (34) within the opening (112, 24) wherein the conductive stud (34) lies substantially completely within the opening (112, 24). The process can also include forming a second barrier layer (52) overlying the conductive stud (34).